SCHEMBL6564064

SCHEMBL6564064

CC(C#Cc1ccccc1)(C#Cc1ccccc1)O[SiH3]

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.44
MAPT P10636 2/20 0.43
NPC1 O15118 2/20 0.36
RAB9A P51151 2/20 0.36
MTOR P42345 1/20 0.36
KCNH2 Q12809 1/20 0.35
CYP1A2 P05177 3/20 0.34
CYP3A4 P08684 2/20 0.34
CYP2C9 P11712 2/20 0.34
CYP2C19 P33261 2/20 0.34
THPO P40225 2/20 0.34
GRM5 P41594 5/20 0.34
NPSR1 Q6W5P4 2/20 0.33
BLM P54132 1/20 0.33
PMP22 Q01453 1/20 0.33
CYP1A1 P04798 1/20 0.33
CYP1B1 Q16678 1/20 0.33
HTR2A P28223 1/20 0.33
KDM4E B2RXH2 1/20 0.32
MEN1 O00255 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6562532 0.80 MAPT (0.41) APPMAPTNPC1RAB9AMTOR
SCHEMBL6563098 0.78 APP (0.48) APPMAPTNPC1RAB9AMTOR
SCHEMBL5328907 0.76 MAPT (0.38) APPMAPTNPC1RAB9AMTOR
SCHEMBL562815 0.75 APP (0.55) APPMAPTNPC1RAB9AMTOR
SCHEMBL2183993 0.75 APP (0.55) APPMAPTNPC1RAB9AMTOR
SCHEMBL6562626 0.75 MAPT (0.40) APPMAPTNPC1RAB9AMTOR
SCHEMBL6561445 0.75 MAPT (0.44) APPMAPTNPC1RAB9AMTOR
SCHEMBL6564084 0.73 APP (0.42) APPMAPTNPC1RAB9AMTOR
SCHEMBL6562566 0.73 MAPT (0.39) APPMAPTNPC1RAB9AMTOR
SCHEMBL6561426 0.72 MAPT (0.41) APPMAPTNPC1RAB9AMTOR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed