SCHEMBL6564437

SCHEMBL6564437

[SiH3]OCC(C#Cc1ccccc1)(C#Cc1ccccc1)c1ccccc1

nearest known ligand 0.38

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.38
MAPT P10636 2/20 0.36
CYP1A2 P05177 1/20 0.34
CYP3A4 P08684 1/20 0.34
CYP2C9 P11712 1/20 0.34
CYP2C19 P33261 1/20 0.34
THPO P40225 1/20 0.34
BLM P54132 1/20 0.33
PMP22 Q01453 1/20 0.33
FFAR1 O14842 2/20 0.32
KCNN4 O15554 1/20 0.31
NPSR1 Q6W5P4 1/20 0.30
HTR2A P28223 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6562881 0.79 APP (0.42) APPMAPTCYP1A2CYP3A4CYP2C9
SCHEMBL6561445 0.76 MAPT (0.44) APPMAPTCYP1A2CYP3A4CYP2C9
SCHEMBL6564327 0.76 TSHR (0.34) KCNN4
SCHEMBL6562562 0.74 MAPT (0.38) APPMAPTCYP1A2CYP3A4CYP2C9
SCHEMBL6564084 0.72 APP (0.42) APPMAPTCYP1A2CYP3A4CYP2C9
SCHEMBL2746389 0.70 MAPT (0.38) APPMAPTCYP1A2CYP3A4CYP2C9
SCHEMBL6562542 0.69 KCNN4 (0.37) APPMAPTCYP1A2FFAR1KCNN4
SCHEMBL6563098 0.69 APP (0.48) APPMAPTCYP1A2CYP3A4CYP2C9
SCHEMBL238217 0.68 KIF11 (0.41) CYP1A2CYP2C9CYP2C19KCNN4
SCHEMBL5328907 0.67 MAPT (0.38) APPMAPTKCNN4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed