SCHEMBL6562626

SCHEMBL6562626

CCC(C#Cc1ccccc1)(C#Cc1ccccc1)O[SiH3]

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.40
APP P05067 1/20 0.39
NPSR1 Q6W5P4 1/20 0.37
CYP1A2 P05177 1/20 0.35
CYP3A4 P08684 1/20 0.35
CYP2C9 P11712 1/20 0.35
CYP2C19 P33261 1/20 0.35
THPO P40225 1/20 0.35
CHRNB2 P17787 1/20 0.35
CHRNB4 P30926 1/20 0.35
CHRNA3 P32297 1/20 0.35
CHRNA7 P36544 1/20 0.35
CHRNA4 P43681 1/20 0.35
BLM P54132 1/20 0.34
PMP22 Q01453 1/20 0.34
HTR2A P28223 1/20 0.34
NPC1 O15118 2/20 0.33
RAB9A P51151 2/20 0.33
GRM5 P41594 1/20 0.33
MTOR P42345 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6562887 0.80 APP (0.43) MAPTAPPNPSR1CYP1A2CYP3A4
SCHEMBL6562562 0.75 MAPT (0.38) MAPTAPPNPSR1CYP1A2CYP3A4
SCHEMBL6564064 0.75 APP (0.44) MAPTAPPNPSR1CYP1A2CYP3A4
SCHEMBL6563098 0.74 APP (0.48) MAPTAPPNPSR1CYP1A2CYP3A4
SCHEMBL6564037 0.73 GAA (0.40) MAPTNPSR1CHRNB2CHRNB4CHRNA3
SCHEMBL6562532 0.72 MAPT (0.41) MAPTAPPNPSR1CYP1A2CYP3A4
Diphenylacetylene SCHEMBL27299894 0.71 APP (0.57) MAPTAPPNPSR1CYP1A2CYP3A4
SCHEMBL9135241 0.71 MAPT (0.51) MAPTAPPNPSR1CYP1A2CYP3A4
SCHEMBL6561445 0.70 MAPT (0.44) MAPTAPPNPSR1CYP1A2CYP3A4
SCHEMBL11048323 0.69 MAPT (0.64) MAPTAPPNPSR1CYP1A2CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed