SCHEMBL6562696

SCHEMBL6562696

CC(=O)O[Si](C#Cc1ccccc1)(C#Cc1ccccc1)OC(C)=O

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPSR1 Q6W5P4 1/20 0.42
FFAR1 O14842 4/20 0.40
APP P05067 1/20 0.39
VCP P55072 1/20 0.39
ALDH1A1 P00352 4/20 0.37
CYP3A4 P08684 2/20 0.37
CYP2D6 P10635 2/20 0.37
CYP2C9 P11712 2/20 0.37
MAPT P10636 1/20 0.37
KDM4E B2RXH2 2/20 0.37
LMNA P02545 2/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
NPC1 O15118 5/20 0.37
RAB9A P51151 5/20 0.37
MTOR P42345 1/20 0.37
MEN1 O00255 2/20 0.37
KMT2A Q03164 2/20 0.37
GRM5 P41594 2/20 0.37
SMN1; SMN2 Q16637 2/20 0.37
TP53 P04637 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6561390 0.85 NPSR1 (0.42) NPSR1FFAR1APPVCPALDH1A1
SCHEMBL6561410 0.85 NPSR1 (0.42) NPSR1FFAR1APPVCPALDH1A1
SCHEMBL6562614 0.84 NPSR1 (0.41) NPSR1FFAR1APPVCPALDH1A1
SCHEMBL6561422 0.84 NPSR1 (0.41) NPSR1FFAR1APPVCPALDH1A1
SCHEMBL6562755 0.82 NPSR1 (0.40) NPSR1FFAR1APPVCPALDH1A1
SCHEMBL6562546 0.81 NPSR1 (0.39) NPSR1FFAR1APPVCPALDH1A1
SCHEMBL6564198 0.81 NPSR1 (0.39) NPSR1FFAR1APPVCPALDH1A1
SCHEMBL6564454 0.81 NPSR1 (0.39) NPSR1FFAR1APPVCPALDH1A1
SCHEMBL6564032 0.81 FFAR1 (0.40) NPSR1FFAR1APPVCPALDH1A1
SCHEMBL6562930 0.80 ALDH1A1 (0.40) NPSR1FFAR1ALDH1A1CYP3A4CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed