SCHEMBL6564037

SCHEMBL6564037

CCC(C#Cc1ccccc1)(C#Cc1ccccc1)C(=O)O[SiH3]

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 1/20 0.40
MAPT P10636 1/20 0.40
FFAR1 O14842 4/20 0.39
HTT P42858 2/20 0.38
NPC1 O15118 1/20 0.38
RAB9A P51151 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
NPSR1 Q6W5P4 2/20 0.38
PAM P19021 1/20 0.37
MMP2 P08253 1/20 0.36
MMP9 P14780 1/20 0.36
MMP12 P39900 1/20 0.36
MMP14 P50281 1/20 0.36
MMP15 P51511 1/20 0.36
MMP16 P51512 1/20 0.36
MMP26 Q9NRE1 1/20 0.36
FFAR4 Q5NUL3 1/20 0.36
VCP P55072 1/20 0.35
LMNA P02545 2/20 0.35
CHRNB2 P17787 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6561426 0.80 MAPT (0.41) MAPTFFAR1NPC1RAB9ANPSR1
SCHEMBL6561387 0.80 FFAR1 (0.40) MAPTFFAR1NPC1RAB9ANPSR1
SCHEMBL6562542 0.75 KCNN4 (0.37) MAPTFFAR1NPC1RAB9ANPSR1
SCHEMBL6562626 0.73 MAPT (0.40) GAAMAPTFFAR1HTTNPC1
Diphenylacetylene SCHEMBL27967498 0.71 APP (0.52) MAPTFFAR1HTTNPC1RAB9A
SCHEMBL28927133 0.70 FFAR1 (0.43) GAAMAPTFFAR1HTTNPC1
SCHEMBL6562562 0.70 MAPT (0.38) GAAMAPTFFAR1HTTNPC1
SCHEMBL10729135 0.70 GAA (0.48) GAAMAPTFFAR1NPSR1ALDH1A1
SCHEMBL9135241 0.70 MAPT (0.51) MAPTFFAR1HTTNPC1RAB9A
SCHEMBL28927161 0.69 MAPT (0.51) MAPTFFAR1NPSR1PAMMMP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed