SCHEMBL6561387

SCHEMBL6561387

O=C(O[SiH3])C(C#Cc1ccccc1)(C#Cc1ccccc1)C#Cc1ccccc1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FFAR1 O14842 6/20 0.40
APP P05067 1/20 0.39
NPSR1 Q6W5P4 1/20 0.38
PAM P19021 1/20 0.37
MAPT P10636 1/20 0.37
NPC1 O15118 3/20 0.36
RAB9A P51151 3/20 0.36
FFAR4 Q5NUL3 1/20 0.36
VCP P55072 1/20 0.35
HNF4A P41235 1/20 0.35
HSP90AA1 P07900 1/20 0.34
AGTR1 P30556 1/20 0.34
PAX8 Q06710 1/20 0.34
TLR9 Q9NR96 1/20 0.34
KDM4E B2RXH2 1/20 0.34
ALDH1A1 P00352 1/20 0.34
LMNA P02545 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
PTGDR2 Q9Y5Y4 1/20 0.34
MEN1 O00255 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6561426 0.82 MAPT (0.41) FFAR1APPNPSR1PAMMAPT
SCHEMBL6562542 0.81 KCNN4 (0.37) FFAR1APPNPSR1PAMMAPT
SCHEMBL6564037 0.80 GAA (0.40) FFAR1NPSR1PAMMAPTNPC1
Diphenylacetylene SCHEMBL27967498 0.72 APP (0.52) FFAR1APPNPSR1PAMMAPT
SCHEMBL6563098 0.70 APP (0.48) FFAR1APPNPSR1MAPTNPC1
Diphenylacetylene SCHEMBL168884 0.67 APP (0.75) FFAR1APPNPSR1PAMMAPT
Bicarbonate SCHEMBL28540490 0.67 MAPT (0.51) FFAR1APPNPSR1MAPTNPC1
SCHEMBL6564064 0.67 APP (0.44) APPNPSR1MAPTNPC1RAB9A
SCHEMBL6562626 0.67 MAPT (0.40) FFAR1APPNPSR1MAPTNPC1
SCHEMBL31454048 0.67 MAPT (0.47) FFAR1APPNPSR1PAMMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed