SCHEMBL6561426

SCHEMBL6561426

CC(C#Cc1ccccc1)(C#Cc1ccccc1)C(=O)O[SiH3]

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 1/20 0.41
NPSR1 Q6W5P4 1/20 0.40
FFAR1 O14842 5/20 0.38
APP P05067 1/20 0.37
VCP P55072 1/20 0.37
KDM4E B2RXH2 1/20 0.36
ALDH1A1 P00352 1/20 0.36
LMNA P02545 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
PTGES O14684 1/20 0.35
NPC1 O15118 3/20 0.35
RAB9A P51151 3/20 0.35
MTOR P42345 1/20 0.35
PAM P19021 1/20 0.35
MEN1 O00255 1/20 0.35
POLB P06746 1/20 0.35
KMT2A Q03164 1/20 0.35
NLRP3 Q96P20 1/20 0.35
KCNN4 O15554 1/20 0.34
RARB P10826 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6561387 0.82 FFAR1 (0.40) MAPTNPSR1FFAR1APPVCP
SCHEMBL6564037 0.80 GAA (0.40) MAPTNPSR1FFAR1VCPKDM4E
SCHEMBL6562542 0.78 KCNN4 (0.37) MAPTNPSR1FFAR1APPVCP
Diphenylacetylene SCHEMBL27967498 0.74 APP (0.52) MAPTNPSR1FFAR1APPVCP
Bicarbonate SCHEMBL28540490 0.72 MAPT (0.51) MAPTNPSR1FFAR1APPVCP
SCHEMBL6564064 0.72 APP (0.44) MAPTNPSR1APPKDM4EALDH1A1
SCHEMBL31454048 0.71 MAPT (0.47) MAPTNPSR1FFAR1APPVCP
SCHEMBL28540489 0.71 MAPT (0.44) MAPTNPSR1FFAR1APPVCP
SCHEMBL10723498 0.71 MAPT (0.50) MAPTNPSR1FFAR1APPVCP
SCHEMBL38664095 0.70 MAPT (0.42) MAPTNPSR1FFAR1APPVCP

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed