SCHEMBL6564096

SCHEMBL6564096

[SiH3]OCc1cccc(C#Cc2ccccc2)c1C#Cc1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MAPT P10636 3/20 0.41
▸ CYP1A2 P05177 3/20 0.41
▸ CYP3A4 P08684 3/20 0.41
▸ CYP2C9 P11712 3/20 0.41
▸ CYP2C19 P33261 3/20 0.41
▸ NPC1 O15118 2/20 0.41
▸ MEN1 O00255 2/20 0.41
▸ ALDH1A1 P00352 2/20 0.41
▸ HPGD P15428 2/20 0.41
▸ KMT2A Q03164 2/20 0.41
▸ HSD17B10 Q99714 2/20 0.41
▸ KDM4E B2RXH2 1/20 0.41
▸ SMN1; SMN2 Q16637 1/20 0.41
▸ APP P05067 1/20 0.39
▸ FFAR1 O14842 8/20 0.37
▸ CA12 O43570 1/20 0.36
▸ CA2 P00918 1/20 0.36
▸ CA9 Q16790 1/20 0.36
▸ RAB9A P51151 1/20 0.36
▸ DHFR P00374 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3797526 0.76 APP (0.60) MAPTCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL9154580 0.72 NPC1 (0.48) MAPTCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL3792911 0.70 APP (0.63) MAPTCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL6562962 0.69 — —
SCHEMBL6564442 0.69 NPC1 (0.39) MAPTCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL2114742 0.67 APP (0.75) MAPTCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL5871989 0.67 APP (0.75) MAPTCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL6365224 0.67 FFAR1 (0.49) MAPTCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL29066988 0.67 FFAR1 (0.35) CYP1A2FFAR1
SCHEMBL5301778 0.66 MAPT (0.50) MAPTCYP1A2CYP3A4CYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 — — EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 — — US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 — — US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 — — EP disclosed
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