SCHEMBL6562962

SCHEMBL6562962

C#Cc1cccc(CO[SiH3])c1C#C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4951389 0.75 GABRA1 (0.41) —
SCHEMBL1514985 0.72 CYP1A1 (0.32) —
SCHEMBL4949097 0.72 CYP2E1 (0.32) —
SCHEMBL8950372 0.70 TDP1 (0.31) —
SCHEMBL4952215 0.69 LIPG (0.36) —
SCHEMBL28568284 0.66 TSHR (0.37) —
SCHEMBL11873749 0.65 CYP1A2 (0.38) —
SCHEMBL6564331 0.64 — —
SCHEMBL29066988 0.64 FFAR1 (0.35) —
SCHEMBL11880176 0.63 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115181223-A Low-gloss matte auxiliary agent, preparation method thereof and formed body 铨盛聚碳科技股份有限公司 2022-10-14 — — CN disclosed
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 — — EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 — — US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 — — US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 — — EP disclosed
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