SCHEMBL6568625

SCHEMBL6568625

O=C(O)c1ccc(Oc2ccccc2C(C(F)(F)F)C(F)(F)F)cc1C(=O)O

nearest known ligand 0.49

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
▸ POLB P06746 2/20 0.49
▸ PYGL P06737 13/20 0.47
▸ PYGM P11217 14/20 0.46
▸ KDM4E B2RXH2 1/20 0.45
▸ ALDH1A1 P00352 1/20 0.44
▸ HPSE Q9Y251 1/20 0.43
▸ GALK1 P51570 1/20 0.42
▸ CASP6 P55212 1/20 0.42
▸ MCL1 Q07820 1/20 0.42
▸ PLEC Q15149 1/20 0.42
▸ TDP1 Q9NUW8 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28675284 0.83 POLB (0.46) POLBPYGLPYGMKDM4EALDH1A1
SCHEMBL29664286 0.81 POLB (0.65) POLBPYGLPYGMKDM4EALDH1A1
SCHEMBL7969637 0.81 POLB (0.65) POLBPYGLPYGMKDM4EALDH1A1
SCHEMBL28335535 0.80 POLB (0.50) POLBPYGLPYGMKDM4EALDH1A1
SCHEMBL28650646 0.79 POLB (0.63) POLBPYGLPYGMKDM4EALDH1A1
SCHEMBL6891584 0.78 POLB (0.66) POLBPYGLPYGMKDM4EALDH1A1
SCHEMBL28634306 0.78 POLB (0.61) POLBPYGLPYGMKDM4EALDH1A1
SCHEMBL6568630 0.77 POLB (0.54) POLBPYGLPYGMKDM4EALDH1A1
SCHEMBL29962773 0.77 POLB (0.54) POLBPYGLPYGMKDM4EALDH1A1
SCHEMBL721512 0.77 POLB (0.50) POLBPYGLPYGMKDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0875906-B1 Electronic part and process for manufacturing the same JSR CORP (JP) 2004-04-07 — — EP disclosed
US-6084053-A AS STRUCTURAL COMPONENT, A DIELECTRIC POLYIMIDE MATERIAL HAVING AT LEAST ONE FLUORENE-CONTAINING STRUCTURAL UNIT; APPLYING POLYIMIDE SOLUTION TO SUBSTRATE, AND DRYING TO FORM THE DIELECTRIC; HEAT RESISTANCE, LOW DIELECTRIC CONSTANT JSR CORPORATION (JP) 2000-07-04 — — US disclosed
EP-0875906-A2 Electronic part and process for manufacturing the same JSR Corporation (JP) 1998-11-04 — — EP disclosed
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