SCHEMBL6639862

SCHEMBL6639862

C=C(C(=O)OCC=O)C1CC2Oc3cccc1c32

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6644028 0.83
SCHEMBL6642001 0.69 GPX4 (0.31)
SCHEMBL27370557 0.69 ADORA3 (0.33)
SCHEMBL6642950 0.65 TYMS (0.32)
SCHEMBL23934507 0.59 ALDH1A1 (0.43)
SCHEMBL2817243 0.58 ALDH1A1 (0.66)
SCHEMBL27455885 0.58 ABCB1 (0.30)
SCHEMBL1006624 0.57
SCHEMBL4356901 0.56 TSHR (0.45)
Hydrochloric Acid SCHEMBL27522953 0.55 ALDH1A1 (0.46)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1422564-A1 Photosensitive thermosetting resin and solder resist ink composition containing the same Great Eastern Resins Industrial Co., Ltd (TW) 2004-05-26 EP claimed
US-20040097689-A1 Photosensitive thermosetting resin and solder resist ink composition containing the same GREAT EASTERN RESINS INDUSTRIAL CO., LTD., TAIWAN, R.O.C. 2004-05-20 US claimed
EP-1422564-A1 Photosensitive thermosetting resin and solder resist ink composition containing the same Great Eastern Resins Industrial Co., Ltd (TW) 2004-05-26 EP disclosed
US-20040097689-A1 Photosensitive thermosetting resin and solder resist ink composition containing the same GREAT EASTERN RESINS INDUSTRIAL CO., LTD., TAIWAN, R.O.C. 2004-05-20 US disclosed