Phosphine

Phosphine

SCHEMBL6661171

OB(Oc1ccccc1)Oc1cccc2ccc3cc4ccccc4cc3c12.P

nearest known ligand 0.36

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 3/20 0.36
ERBB2 P04626 1/20 0.36
FYN P06241 1/20 0.36
MAOA P21397 1/20 0.36
ACHE P22303 1/20 0.36
AHR P35869 1/20 0.36
ALDH1A1 P00352 6/20 0.33
KDM4E B2RXH2 5/20 0.33
GAA P10253 2/20 0.33
RXRA P19793 1/20 0.33
PPARG P37231 1/20 0.33
PPARD Q03181 1/20 0.33
PPARA Q07869 1/20 0.33
MAPT P10636 2/20 0.33
TDP1 Q9NUW8 1/20 0.33
KCNA3 P22001 1/20 0.32
MEN1 O00255 3/20 0.31
KMT2A Q03164 3/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
NQO1 P15559 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL9443279 0.96 CYP1A2 (0.38) CYP1A2ERBB2FYNMAOAACHE
Phosphine SCHEMBL131517 0.94 CYP1A2 (0.40) CYP1A2ERBB2FYNMAOAACHE
Ammonia Solution, Strong SCHEMBL6841646 0.91 CYP1A2 (0.40) CYP1A2ERBB2FYNMAOAACHE
SCHEMBL10425743 0.90 CYP1A2 (0.42) CYP1A2ERBB2FYNMAOAACHE
SCHEMBL9443322 0.88 CYP1A2 (0.41) CYP1A2ERBB2FYNMAOAACHE
SCHEMBL29289440 0.86 ALDH1A1 (0.38) CYP1A2ALDH1A1KDM4EGAAMAPT
Phosphine SCHEMBL7860002 0.86 CYP1A2 (0.34) CYP1A2ERBB2FYNMAOAACHE
Phosphine SCHEMBL3288817 0.85 CYP1A2 (0.40) CYP1A2ERBB2FYNMAOAACHE
SCHEMBL2013080 0.84 CYP1A2 (0.37) CYP1A2ERBB2FYNMAOAACHE
SCHEMBL6249069 0.84 PPARG (0.39) CYP1A2ERBB2FYNMAOAACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040230000-A1 Epoxy resins, phenolic resins, a synthetic rubber (acrylonitrile-butadiene), and microcapsules having a thermoplastic resin shell; improved bonding strength and storage stability; microelectronics; pressure sensitive adhesives NITTO DENKO CORPORATION (JP) 2004-11-18 US disclosed
EP-1437394-A1 Adhesives composition, adhesive film, and semiconductor apparatus using the same NITTO DENKO CORPORATION (JP) 2004-07-14 EP disclosed