Phosphine

Phosphine

SCHEMBL131517

OB(Oc1cccc2ccc3cc4ccccc4cc3c12)Oc1cccc2ccc3cc4ccccc4cc3c12.P

nearest known ligand 0.40

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 4/20 0.40
ERBB2 P04626 1/20 0.40
FYN P06241 1/20 0.40
MAOA P21397 1/20 0.40
ACHE P22303 1/20 0.40
AHR P35869 1/20 0.40
ALDH1A1 P00352 8/20 0.37
GAA P10253 3/20 0.37
KDM4E B2RXH2 2/20 0.37
RXRA P19793 1/20 0.35
PPARG P37231 1/20 0.35
PPARD Q03181 1/20 0.35
PPARA Q07869 1/20 0.35
HSD17B10 Q99714 6/20 0.34
HPGD P15428 4/20 0.34
HIF1A Q16665 2/20 0.34
CYP1B1 Q16678 2/20 0.34
THRB P10828 1/20 0.34
NQO1 P15559 1/20 0.34
CA1 P00915 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL6841646 0.97 CYP1A2 (0.40) CYP1A2ERBB2FYNMAOAACHE
SCHEMBL10425743 0.95 CYP1A2 (0.42) CYP1A2ERBB2FYNMAOAACHE
Phosphine SCHEMBL6661171 0.94 CYP1A2 (0.36) CYP1A2ERBB2FYNMAOAACHE
SCHEMBL9443322 0.94 CYP1A2 (0.41) CYP1A2ERBB2FYNMAOAACHE
Phosphine SCHEMBL7860002 0.92 CYP1A2 (0.34) CYP1A2ERBB2FYNMAOAACHE
Phosphine SCHEMBL3288817 0.90 CYP1A2 (0.40) CYP1A2ERBB2FYNMAOAACHE
Ammonia Solution, Strong SCHEMBL9443279 0.90 CYP1A2 (0.38) CYP1A2ERBB2FYNMAOAACHE
SCHEMBL6249069 0.89 PPARG (0.39) CYP1A2ERBB2FYNMAOAACHE
SCHEMBL2013080 0.89 CYP1A2 (0.37) CYP1A2ERBB2FYNMAOAACHE
SCHEMBL19259375 0.89 CYP1A2 (0.41) CYP1A2ERBB2FYNMAOAACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 527 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114793438-B Resin composition 索路思高新材料有限公司 2024-04-23 CN claimed
CN-105899569-B Liquid epoxy resin composition for semiconductor encapsulation and resin-encapsulated semiconductor device 信越化学工业株式会社 2018-04-10 CN claimed
CN-105899569-A Liquid epoxy resin composition for semiconductor encapsulation and resin-encapsulated semiconductor device 信越化学工业株式会社 2016-08-24 CN claimed
US-6512031-B1 First curing agent for polymerizing the epoxy resin into a linear polymer, and a second curing agent for crosslinking the linear polymer into a three-dimensional polymer. The use of two curing agents corresponding to straight chain growth SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-01-28 US claimed
US-5188767-A Mixture of epoxy and phenolic resin with organic borate and organosilicon compound HITACHI CHEMICAL CO., LTD. (JP) 1993-02-23 US claimed
JP-54113256-A None JP disclosed
US-20260132243-A1 THERMOSETTING COMPOSITION AND CURED PRODUCT THEREOF, PHOTOMELTABLE COMPOSITION, AND STRUCTURAL BODY PRODUCTION METHOD RESONAC CORP (JP) 2026-05-14 US disclosed
EP-4410859-B1 THERMOSETTING COMPOSITION AND CURED PRODUCT THEREOF, PHOTO-MELTABLE COMPOSITION, AND STRUCTURAL BODY PRODUCTION METHOD RESONAC CORP (JP) 2026-04-29 EP disclosed
EP-4730027-A2 OPTICAL ACTIVATION OF CHEMICAL ENTITIES IN ELECTROPHORETIC DISPERSIONS FOR DISPLAY DEVICES Halion Displays Inc. (CA) 2026-04-22 EP disclosed
EP-3877807-B1 OPTICAL ACTIVATION OF CHEMICAL ENTITIES IN ELECTROPHORETIC DISPERSIONS FOR DISPLAY DEVICES HALION DISPLAYS INC (CA) 2026-04-08 EP disclosed
EP-3971920-B1 RESIN COMPOSITION AJINOMOTO KK (JP) 2026-04-01 EP disclosed
CN-121574357-A Catalyst system EPC工程与技术有限公司 2026-02-27 CN disclosed
US-5350811-A Semiconductors of metallic layers and adhesives containing epoxy resins with carboxy compounds of disiloxanes HITACHI CHEMICAL CO. LTD. (JP) 1994-09-27 US disclosed
US-5258139-A Curable composition for bonding semiconductor chips to copper frames HITACHI CHEMICAL COMPANY, LTD. (JP) 1993-11-02 US disclosed
US-5244939-A Improved adhesion SOMAR CORPORATION (JP) 1993-09-14 US disclosed
US-5218015-A Zeolite, fine silica powder, silane coupling agent and a polysiloxane compound SOMAR CORPORATION (JP) 1993-06-08 US disclosed
US-5188767-A Mixture of epoxy and phenolic resin with organic borate and organosilicon compound HITACHI CHEMICAL CO., LTD. (JP) 1993-02-23 US disclosed
EP-0421390-A2 Hardening agent composition, method of preparing the same and thermosetting epoxy resin composition SOMAR CORPORATION (JP) 1991-04-10 EP disclosed
EP-0421389-A2 Imidazole compound-containing hardening agent composition, method of preparing the same and thermosetting epoxy resin composition SOMAR CORPORATION (JP) 1991-04-10 EP disclosed
JP-S54113256-A PRODUCTION OF RESIN SEAL SEMICONDUCTOR DEVICE HITACHI LTD 1979-09-04 JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260132243-A1 THERMOSETTING COMPOSITION AND CURED PRODUCT THEREOF, PHOTOMELTABLE COMPOSITION, AND STRUCTURAL BODY PRODUCTION METHOD RER1, OXTR, MAP1LC3A CYP1A2 416/4885ERBB2 1664/4885FYN 2718/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.