Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 1/20 | 0.33 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.33 |
| ▸ | CHRNB2 | P17787 | 1/20 | 0.33 |
| ▸ | CHRNA4 | P43681 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | JAK2 | O60674 | 1/20 | 0.31 |
| ▸ | JAK1 | P23458 | 1/20 | 0.31 |
| ▸ | TYK2 | P29597 | 1/20 | 0.31 |
| ▸ | JAK3 | P52333 | 1/20 | 0.31 |
| ▸ | SMYD3 | Q9H7B4 | 1/20 | 0.31 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.31 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.31 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.31 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.31 |
| ▸ | CACNA1C | Q13936 | 1/20 | 0.31 |
| ▸ | KIF11 | P52732 | 1/20 | 0.30 |
| ▸ | IDO1 | P14902 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30335334 | 0.80 | JAK2 (0.35) | JAK2JAK1TYK2JAK3 | |
| SCHEMBL16955226 | 0.79 | ADRA2A (0.30) | — | |
| SCHEMBL27560405 | 0.78 | NOTUM (0.45) | ALDH1A1GAA | |
| SCHEMBL6702150 | 0.78 | SPHK1 (0.34) | — | |
| SCHEMBL1289467 | 0.75 | — | — | |
| SCHEMBL27923987 | 0.75 | — | — | |
| SCHEMBL6684632 | 0.75 | GABRA1 (0.39) | HIF1ALMNASMYD3GABRA1GABRB2 | |
| SCHEMBL15577022 | 0.74 | KDM4E (0.40) | HTT | |
| SCHEMBL27698800 | 0.73 | GABRA1 (0.34) | HIF1ALMNAGABRA1GABRB2PTGS1 | |
| SCHEMBL17066211 | 0.73 | SPHK1 (0.47) | ALDH1A1HTTIDO1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6780963-B2 | HAS A SOLDER REFLOW HEAT-RESISTANT TEMPERATURE OF NOT LOWER THAN 250 DEGREES C. | MITSUI CHEMICALS, INC. (JP) | 2004-08-24 | — | — | US | claimed |
| CN-111770965-B | Polyamide resin composition, molded article thereof, and method for producing laser welded body | 三井化学株式会社 | 2023-04-04 | — | — | CN | disclosed |
| CN-113412298-A | Flame-retardant polyamide resin composition | 三井化学株式会社 | 2021-09-17 | — | — | CN | disclosed |
| EP-3753985-A1 | POLYAMIDE RESIN COMPOSITION, MOLDED BODY THEREOF, AND METHOD FOR MANUFACTURING LASER-WELDED BODY | Mitsui Chemicals, Inc. (JP) | 2020-12-23 | — | — | EP | disclosed |
| CN-111770965-A | Polyamide resin composition, molded article thereof, and method for producing laser welded body | 三井化学株式会社 | 2020-10-13 | — | — | CN | disclosed |
| WO-2020184270-A1 | FLAME-RETARDANT POLYAMIDE RESIN COMPOSITION | 三井化学株式会社 | 2020-09-17 | — | — | WO | disclosed |
| CN-100406522-C | Flame-retardant polyamide composition and its use | MITSUI CHEMICALS INC (JP) | 2008-07-30 | — | — | CN | disclosed |
| CN-1312222-C | Molding material for electrical and electronic parts | MITSUI CHEMICALS INC (JP) | 2007-04-25 | — | — | CN | disclosed |
| CN-1914276-A | Flame-retardant polyamide composition and use thereof | MITSUI CHEMICALS INC (JP) | 2007-02-14 | — | — | CN | disclosed |
| EP-1479710-A1 | Production of polymer compounds between polyester and diamine, a polymer compound and a structure including thereof | M & S Research and Development Co., Ltd. (JP) | 2004-11-24 | — | — | EP | disclosed |
| CN-1404507-A | Molding material for electrical and electronic parts | MITSUI CHEMICALS INC (JP) | 2003-03-19 | — | — | CN | disclosed |
| CN-1090643-C | Semiaromatic polyamide, process for producing the same, and composition containing the same | MITSUI PETROCHEMICAL IND (JP) | 2002-09-11 | — | — | CN | disclosed |
| CN-1168898-A | Methnod of producing polyamide resin | M & S RESEARCH AND DEV CO LTD (JP) | 1997-12-31 | — | — | CN | disclosed |
| CN-1166843-A | Semiaromatic polyamide, process for producing the same, and composition containing the same | MITSUI PETROCHEMICAL IND (JP) | 1997-12-03 | — | — | CN | disclosed |
| EP-0406859-B1 | Process for producing a resin molded article having a metal plated layer thereon | MITSUI PETROCHEMICAL IND (JP) | 1996-01-10 | — | — | EP | disclosed |