SCHEMBL1289467

SCHEMBL1289467

CC(C)c1ccc(C2CCC(N)CC2)c(C(C)C)c1C1CCC(N)CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6702150 0.84 SPHK1 (0.34)
SCHEMBL6684632 0.81 GABRA1 (0.39)
SCHEMBL6685905 0.75 ALDH1A1 (0.33)
SCHEMBL30335334 0.72 JAK2 (0.35)
SCHEMBL11863751 0.66 HTR1A (0.40)
SCHEMBL16956096 0.65 GABRA1 (0.45)
SCHEMBL18790124 0.65 HTR2C (0.46)
SCHEMBL15577034 0.65 ADRA2A (0.35)
SCHEMBL15577022 0.64 KDM4E (0.40)
SCHEMBL16956094 0.63 GABRA1 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2012047360-A1 FUNCTIONALIZED POLYETHYLENE TEREPHTHALATE POLYMERS, FUNCTIONALIZED DERIVATIVE POLYMERS OF POLYETHYLENE TEREPHTHALATE, METHODS OF MAKING AND USING SAME FELICE KRISTOPHER M (US) 2012-04-12 WO disclosed
US-20040214959-A1 Production of polymer compounds between polyester and diamine, a polymer compound and a structure including thereof M&S RESEARCH AND DEVELOPMENT CO., LTD. (JP) 2004-10-28 US disclosed
EP-1273628-A1 MOLDING MATERIAL FOR ELECTRICAL AND ELECTRONIC PARTS Mitsui Chemicals, Inc. (JP) 2003-01-08 EP disclosed
US-6133406-A CONDENSATION POLYMERIZATION TO FORM LOW MOLECULAR WEIGHT POLYAMIDE, THEN SOLID PHASE POLYMERIZATION TO INCREASE MOLECULAR WEIGHT TO YIELD HIGH MELTING, HEAT RESISTANT AROMATIC POLYAMIDE MITSUI CHEMICALS, INC. (JP) 2000-10-17 US disclosed
EP-0397531-B1 Thermoplastic resin composition and use thereof MITSUI PETROCHEMICAL IND (JP) 1995-08-02 EP disclosed
EP-0406859-A2 Process for producing a resin molded article having a metal plated layer thereon MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1991-01-09 EP disclosed
EP-0397531-A2 Thermoplastic resin composition and use thereof MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1990-11-14 EP disclosed