SCHEMBL6700611

SCHEMBL6700611

O=C(OC1C=Cc2ccccc21)OC1C=Cc2ccccc21

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.39
KDM4E B2RXH2 2/20 0.39
ALDH1A1 P00352 1/20 0.39
SIGMAR1 Q99720 2/20 0.35
HTR2A P28223 2/20 0.34
HTR6 P50406 1/20 0.34
CYP2D6 P10635 2/20 0.33
ATM Q13315 1/20 0.33
P2RX4 Q99571 1/20 0.33
MAPT P10636 1/20 0.33
HDAC4 P56524 2/20 0.33
HDAC3 O15379 1/20 0.32
HDAC7 Q8WUI4 1/20 0.32
HDAC8 Q9BY41 1/20 0.32
HDAC6 Q9UBN7 1/20 0.32
HDAC9 Q9UKV0 1/20 0.32
HDAC5 Q9UQL6 1/20 0.32
NCOR2 Q9Y618 1/20 0.32
RET P07949 1/20 0.32
LMNA P02545 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30931450 0.87 POLB (0.38) POLBKDM4EALDH1A1SIGMAR1HTR2A
SCHEMBL8697270 0.85 POLB (0.49) POLBKDM4EALDH1A1HTR2AHTR6
SCHEMBL27926152 0.85 ALDH1A1 (0.38) POLBKDM4EALDH1A1HTR2AHTR6
SCHEMBL89374 0.85 POLB (0.49) POLBKDM4EALDH1A1HTR2AHTR6
SCHEMBL8694188 0.85 POLB (0.49) POLBKDM4EALDH1A1HTR2AHTR6
SCHEMBL50555 0.84 POLB (0.37) POLBKDM4EALDH1A1HTR2AHTR6
SCHEMBL28304038 0.84 POLB (0.47) POLBKDM4EALDH1A1HTR2AHTR6
SCHEMBL29059172 0.84 POLB (0.37) POLBKDM4EALDH1A1HTR2AHTR6
SCHEMBL31072333 0.83 KDM4E (0.35) POLBKDM4EALDH1A1SIGMAR1HTR2A
SCHEMBL31072332 0.83 KDM4E (0.35) POLBKDM4EALDH1A1SIGMAR1HTR2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114478987-A Polyurethane, method for producing polyurethane, conductive paste composition, conductive wiring, and method for producing conductive wiring 信越化学工业株式会社 2022-05-13 CN disclosed
US-20040056196-A1 Method and apparatus for monitoring environment and apparatus for producing semiconductor NIWANO, MICHIO (JP) 2004-03-25 US disclosed
JP-2001019689-A PRODUCTION OF INDENE CARBONATE ADCHEMCO CORP 2001-01-23 JP disclosed
JP-2001019689-A PRODUCTION OF INDENE CARBONATE ADCHEMCO CORP 2001-01-23 JP disclosed
EP-0244019-B1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE, IN WHICH A NEGATIVE IMAGE IS FORMED ON A SEMICONDUCTOR SUBSTRATE IN A POSITIVE PHOTOLACQUER Koninklijke Philips Electronics N.V. (NL) 1991-09-11 EP disclosed
US-4937176-A Method of manufacturing a semiconductor device, in which a negative image is formed on a semiconductor substrate in a positive photolacquer U.S. PHILIPS CORPORATION (US) 1990-06-26 US disclosed
EP-0192302-B1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE, IN WHICH A PHOTOLACQUER MASK IS FORMED BY MEANS OF A TWO-LAYER LACQUER SYSTEM Koninklijke Philips Electronics N.V. (NL) 1990-05-02 EP disclosed
EP-0244019-A1 Method of manufacturing a semiconductor device, in which a negative image is formed on a semiconductor substrate in a positive photolacquer Koninklijke Philips Electronics N.V. (NL) 1987-11-04 EP disclosed
US-4704347-A Method of manufacturing a semiconductor device, in which a photolacquer mask is formed by means of a two-layer lacquer system. U.S. PHILIPS CORPORATION (US) 1987-11-03 US disclosed
EP-0192302-A1 Method of manufacturing a semiconductor device, in which a photolacquer mask is formed by means of a two-layer lacquer system Koninklijke Philips Electronics N.V. (NL) 1986-08-27 EP disclosed