SCHEMBL6704022

SCHEMBL6704022

CCCCCP.O=C(O)Nc1nc2ccccc2[nH]1

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 10/20 0.67
RAB9A P51151 10/20 0.67
SMN1; SMN2 Q16637 5/20 0.67
ALDH1A1 P00352 3/20 0.67
SPHK2 Q9NRA0 1/20 0.66
SPHK1 Q9NYA1 1/20 0.66
LMNA P02545 2/20 0.57
PKM P14618 3/20 0.56
KLF5 Q13887 2/20 0.56
MEN1 O00255 1/20 0.55
KMT2A Q03164 1/20 0.55
MAOB P27338 1/20 0.54
ADORA2A P29274 1/20 0.54
BCHE P06276 1/20 0.54
TRPC3 Q13507 1/20 0.54
TRPC4 Q9UBN4 1/20 0.54
TRPC5 Q9UL62 1/20 0.54
HSD17B10 Q99714 2/20 0.54
MAPK1 P28482 1/20 0.54
CYP3A4 P08684 1/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL204726 0.84 NPC1 (0.73) NPC1RAB9ASMN1; SMN2ALDH1A1LMNA
SCHEMBL9816345 0.81 NPC1 (1.00) NPC1RAB9ASMN1; SMN2ALDH1A1SPHK2
SCHEMBL17817588 0.80 SPHK2 (1.00) NPC1RAB9ASMN1; SMN2ALDH1A1SPHK2
SCHEMBL5973026 0.78 LMNA (0.69) NPC1RAB9ASMN1; SMN2ALDH1A1SPHK2
SCHEMBL5492024 0.78 LMNA (0.64) NPC1RAB9ASMN1; SMN2ALDH1A1LMNA
SCHEMBL11703652 0.78 SPHK2 (0.70) NPC1RAB9ASMN1; SMN2ALDH1A1SPHK2
SCHEMBL6704028 0.77 NPC1 (0.63) NPC1RAB9ASMN1; SMN2ALDH1A1SPHK2
SCHEMBL11742917 0.77 NPC1 (0.67) NPC1RAB9ASMN1; SMN2ALDH1A1SPHK2
SCHEMBL11801720 0.77 SPHK2 (0.68) NPC1RAB9ASMN1; SMN2ALDH1A1SPHK2
SCHEMBL11865449 0.76 NPC1 (0.65) NPC1RAB9ASMN1; SMN2ALDH1A1SPHK2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-2004319676-A SOLDER DEPOSITION METHOD AND SOLDER BUMP FORMING METHOD HARIMA CHEM INC 2004-11-11 JP disclosed