Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | GMNN | O75496 | 1/20 | 0.31 |
| ▸ | PPM1B | O75688 | 1/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | PPP1CC | P36873 | 1/20 | 0.31 |
| ▸ | TFPI2 | P48307 | 1/20 | 0.31 |
| ▸ | RAB9A | P51151 | 1/20 | 0.31 |
| ▸ | PPP5C | P53041 | 1/20 | 0.31 |
| ▸ | PPP1CA | P62136 | 1/20 | 0.31 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
| ▸ | TP53 | P04637 | 1/20 | 0.31 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.31 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.31 |
| ▸ | THPO | P40225 | 1/20 | 0.31 |
| ▸ | NSD2 | O96028 | 1/20 | 0.31 |
| ▸ | HK1 | P19367 | 1/20 | 0.31 |
| ▸ | HKDC1 | Q2TB90 | 1/20 | 0.31 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10593202 | 0.85 | — | — | |
| SCHEMBL6215321 | 0.82 | NSD2 (0.48) | NSD2HK1HKDC1 | |
| SCHEMBL6703741 | 0.79 | PPARG (0.31) | — | |
| SCHEMBL11766943 | 0.78 | KMT2A (0.41) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL7175398 | 0.78 | KMT2A (0.41) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL4352284 | 0.78 | KMT2A (0.41) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL1473414 | 0.78 | KMT2A (0.41) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL1739727 | 0.78 | KMT2A (0.41) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL17122004 | 0.76 | NSD2 (0.33) | NSD2HK1HKDC1 | |
| SCHEMBL13719383 | 0.75 | KDM4E (0.31) | KDM4EGMNNPPM1BLMNAPPP1CC |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20040053055-A1 | Rubber toughened epoxy resins for resin infusion processing, methods of using the resins and articles made therefrom | GOODRICH CORPORATION | 2004-03-18 | — | — | US | disclosed |
| EP-0653904-B1 | Via fill compositions for direct attach of devices and methods for applying same | IBM (US) | 2002-12-11 | — | — | EP | disclosed |
| EP-1233663-A2 | Via fill compositions for direct attach of devices and methods for applying same | International Business Machines Corporation (US) | 2002-08-21 | — | — | EP | disclosed |
| US-6197122-B1 | THERMALLY DECOMPOSING ENCAPSULATION AND UNDERFILL TO PROVIDE RESIDUE ON ELECTRONIC COMPONENTS AND DISSOLVING RESIDUE IN POLAR OR BASIC SOLVENT TO EXPOSE ELECTRONIC COMPONENTS | CORNELL RESEARCH FOUNDATION, INC. | 2001-03-06 | — | — | US | disclosed |
| US-6194024-B1 | CONNECTING TWO CIRCUIT CARRIERS; FILLING HOLE WITH SOLDER SPHERE | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2001-02-27 | — | — | US | disclosed |
| US-6134772-A | Via fill compositions for direct attach of devices and methods of applying same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2000-10-24 | — | — | US | disclosed |
| US-6106891-A | APPLYING A CURABLE FILL TO AN APERTURE, PEELING A LAYER OF POLYMER, APPLYING HEAT AND PRESSURE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2000-08-22 | — | — | US | disclosed |
| US-5973033-A | CURED THERMOSETS FOR ENCAPSULATION AND UNDERFILL FOR ELECTRONIC COMPONENTS THAT ARE THERMALLY DECOMPOSABLE TO ALLOW REPAIR, REPLACEMENT, RECOVERY OR RECYCLING OF OPERATIVE ELECTRONIC COMPONENTS | CORNELL RESEARCH FOUNDATION, INC. (US) | 1999-10-26 | — | — | US | disclosed |
| US-5948922-A | CROSSLINKING THERMOSETTING RESINS | CORNELL RESEARCH FOUNDATION, INC. (US) | 1999-09-07 | — | — | US | disclosed |
| US-5887345-A | Method for applying curable fill compositon to apertures in a substrate | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1999-03-30 | — | — | US | disclosed |
| US-5766670-A | Via fill compositions for direct attach of devices and methods for applying same | INTERNATIONAL BUSINESS MACHINES CORPORATION | 1998-06-16 | — | — | US | disclosed |
| US-5571593-A | CIRCUIT CARRIERS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1996-11-05 | — | — | US | disclosed |
| EP-0653904-A2 | Via fill compositions for direct attach of devices and methods for applying same | International Business Machines Corporation (US) | 1995-05-17 | — | — | EP | disclosed |
| US-4398013-A | HALOGENONIUM SALT | GENERAL ELECTRIC COMPANY (US) | 1983-08-09 | — | — | US | disclosed |
| US-3977996-A | CHROMIUM (III) CARBOXYLATE, COCATALYST | AEROJET-GENERAL CORPORATION (US) | 1976-08-31 | — | — | US | disclosed |
| US-3978026-A | SYNERGISTIC, CHROMIUMIII TRICARBOXYLATE, COCATALYST | AEROJET-GENERAL CORPORATION (US) | 1976-08-31 | — | — | US | disclosed |
| US-3956241-A | CHROMIUM(III) CHELATE COMPOUND | AEROJET-GENERAL CORPORATION (US) | 1976-05-11 | — | — | US | disclosed |