⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL444098 | 0.71 | — | — | |
| SCHEMBL153673 | 0.68 | — | — | |
| SCHEMBL1971726 | 0.66 | — | — | |
| SCHEMBL19793 | 0.65 | — | — | |
| SCHEMBL10528427 | 0.64 | — | — | |
| SCHEMBL9063964 | 0.64 | — | — | |
| SCHEMBL31256609 | 0.63 | — | — | |
| SCHEMBL10679627 | 0.63 | MEN1 (0.31) | — | |
| SCHEMBL4340250 | 0.61 | — | — | |
| SCHEMBL22167638 | 0.61 | CAMKK2 (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 156 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118206718-A | Core-shell material and preparation method thereof | 华为技术有限公司 | 2024-06-18 | — | — | CN | claimed |
| CN-117946494-A | Epoxy plastic packaging material for packaging discrete devices and application thereof | 江苏中科科化新材料股份有限公司 | 2024-04-30 | — | — | CN | claimed |
| CN-110791052-B | High-reliability epoxy resin composition and application thereof | 昆山兴凯半导体材料有限公司 | 2023-07-07 | — | — | CN | claimed |
| CN-108384195-B | Nickel-to-epoxy resin composition with high adhesion and application thereof | 长兴电子材料（昆山）有限公司 | 2020-06-30 | — | — | CN | claimed |
| CN-108485185-B | High-reliability high-fluidity epoxy resin composition for vehicles and application thereof | 长兴电子材料（昆山）有限公司 | 2020-06-30 | — | — | CN | claimed |
| CN-111153631-A | High-thermal-conductivity and high-reliability epoxy resin composition and application thereof | 长兴电子材料（昆山）有限公司 | 2020-05-15 | — | — | CN | claimed |
| CN-110791052-A | High-reliability epoxy resin composition and application thereof | 长兴电子材料（昆山）有限公司 | 2020-02-14 | — | — | CN | claimed |
| US-10465037-B2 | High heat monomers and methods of use thereof | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2019-11-05 | — | — | US | claimed |
| CN-108728010-A | A kind of denatured conductive filler, preparation method and application | 中国科学院苏州纳米技术与纳米仿生研究所 | 2018-11-02 | — | — | CN | claimed |
| CN-108384195-A | It is a kind of to nickel high-adhesion epoxy resin component and its application | 长兴电子材料（昆山）有限公司 | 2018-08-10 | — | — | CN | claimed |
| US-20170158806-A1 | HIGH HEAT MONOMERS AND METHODS OF USE THEREOF | SHPP GLOBAL TECHNOLOGIES B.V. (NL) | 2017-06-08 | — | — | US | claimed |
| CN-106536589-A | High heat monomer and method of use thereof | 沙特基础工业全球技术有限公司 | 2017-03-22 | — | — | CN | claimed |
| CN-102352090-B | Flame retarded epoxy resin composite material | CHANGXING ELECTRONIC MATERIAL KUNSHAN CO LTD | 2013-04-03 | — | — | CN | claimed |
| CN-102352090-A | Flame retarded epoxy resin composite material | CHANGXING ELECTRONIC MATERIAL KUNSHAN CO LTD | 2012-02-15 | — | — | CN | claimed |
| CN-100398592-C | Flame retardant, flame-retardant resin composition containing same and use thereof | ETERNAL CHEMICAL INDUSTRY CO LTD (CN) | 2008-07-02 | — | — | CN | claimed |
| CN-1865329-A | Flame retardant, flame-retardant resin composition containing same and use thereof | ETERNAL CHEMICAL INDUSTRY CO LTD (CN) | 2006-11-22 | — | — | CN | claimed |
| CN-118786161-A | Copolymers derived from dicyclopentadiene | 高新特殊工程塑料全球技术有限公司 | 2024-10-15 | — | — | CN | disclosed |
| CN-118251440-A | Copolymers derived from dicyclopentadiene | 高新特殊工程塑料全球技术有限公司 | 2024-06-25 | — | — | CN | disclosed |
| EP-0947532-A1 | Epoxy resin composition for printed circuit board and printed circuit board using the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1999-10-06 | — | — | EP | disclosed |
| US-5747557-A | MIXING UNDER SHEAR FORCE; UNIFORM DISPERSION | KABUSHIKI KAISHA TOSHIBA (JP) | 1998-05-05 | — | — | US | disclosed |