Sulfuric Acid

Sulfuric Acid

SCHEMBL6727151

CCS(=O)(=O)O.CS(=O)(=O)O.O=S(=O)(O)O

nearest known ligand 0.46

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

FGFR1FGFR2FGFR3FGFR4FLT1FLT4KDRPDGFRAPDGFRB

The experimentally established mechanism targets of Sulfuric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA5A P35218 2/20 0.46
CA5B Q9Y2D0 2/20 0.46
CA2 P00918 4/20 0.41
KDM4E B2RXH2 3/20 0.36
CYP3A4 P08684 2/20 0.36
BLM P54132 3/20 0.35
CYP2C19 P33261 2/20 0.35
PTGS1 P23219 1/20 0.35
PDE4A P27815 1/20 0.35
LMNA P02545 1/20 0.35
SLC6A6 P31641 1/20 0.35
TP53 P04637 2/20 0.35
CA1 P00915 5/20 0.33
APP P05067 1/20 0.32
CYP2D6 P10635 1/20 0.32
NPSR1 Q6W5P4 1/20 0.32
TSHR P16473 2/20 0.31
NT5E P21589 1/20 0.31
CA4 P22748 1/20 0.31
CA6 P23280 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1043227 0.96 CA2 (0.44) CA5ACA5BCA2KDM4ECYP3A4
Sulfuric Acid SCHEMBL8456023 0.92 CA5A (0.55) CA5ACA5BCA2KDM4ECYP3A4
Sulfuric Acid SCHEMBL28276552 0.92 CA5A (0.55) CA5ACA5BCA2KDM4ECYP3A4
SCHEMBL1904 0.88
SCHEMBL126970 0.88
SCHEMBL2058760 0.88 CA5A (0.46) CA5ACA5BCA2KDM4ECYP3A4
Dimethylamine SCHEMBL27659636 0.85
Methyl Alcohol SCHEMBL23421569 0.84
SCHEMBL22581624 0.84
SCHEMBL7587151 0.84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6797146-B2 CONTACTING WITH AN ELECTROPLATING BATH OF A SOURCE OF METAL IONS, AN ELECTROLYTE COMPRISING TWO OR MORE ACIDS, AND ADDITIVES SHIPLEY COMPANY, L.L.C. 2004-09-28 US disclosed
US-6679983-B2 BATH, SOURCE OF METAL IONS, AN ELECTROLYTE COMPRISING TWO OR MORE ACIDS AND OPTIONAL ADDITIVE(S); FILL OF SMALL FEATURES WITH LESS OVERPLATE; COPPER ELECTROPLATING SHIPLEY COMPANY, L.L.C. 2004-01-20 US disclosed
US-20020053519-A1 Seed layer repair SHIPLEY COMPANY, L.L.C. 2002-05-09 US disclosed
EP-1199383-A2 Seed layer repair bath Shipley Company LLC (US) 2002-04-24 EP disclosed
EP-1197586-A2 Electrolyte Shipley Company LLC (US) 2002-04-17 EP disclosed