⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2816656 | 0.80 | — | — | |
| SCHEMBL11593712 | 0.74 | KMT2A (0.42) | — | |
| SCHEMBL6905424 | 0.69 | — | — | |
| SCHEMBL22325552 | 0.68 | ALDH1A1 (0.35) | — | |
| SCHEMBL7450684 | 0.66 | NPSR1 (0.36) | — | |
| SCHEMBL29117785 | 0.66 | CYP3A4 (0.35) | — | |
| SCHEMBL27598235 | 0.66 | CYP3A4 (0.35) | — | |
| SCHEMBL28493598 | 0.64 | ALDH1A1 (0.34) | — | |
| SCHEMBL7125894 | 0.64 | GLA (0.40) | — | |
| SCHEMBL3880867 | 0.64 | RECQL (0.37) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240109808-A1 | LIVING BUILDING MATERIALS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME | PROMETHEUS MATERIALS INC. | 2024-04-04 | — | — | US | disclosed |
| WO-2024059274-A2 | LIVING BUILDING MATERIALS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME | THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE (US) | 2024-03-21 | — | — | WO | disclosed |
| US-10759119-B2 | Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object | SEIKO EPSON CORPORATION (JP) | 2020-09-01 | — | — | US | disclosed |
| US-20190054704-A1 | THREE DIMENSIONAL MOLD OBJECT MANUFACTURING APPARATUS, METHOD FOR MANUFACTURING THREE DIMENSIONAL MOLD OBJECT, AND THREE DIMENSIONAL MOLD OBJECT | SEIKO EPSON CORPORATION (JP) | 2019-02-21 | — | — | US | disclosed |
| CN-107001673-A | Composition and method for improving adhesion with sputtered coatings | 埃西勒国际通用光学公司 | 2017-08-01 | — | — | CN | disclosed |
| US-8053528-B2 | Binder compositions for fiber mats, and fiber mats and articles comprising them | GEORGIA-PACIFIC CHEMICALS LLC (US) | 2011-11-08 | — | — | US | disclosed |
| US-20090124151-A1 | BINDER COMPOSITIONS FOR FIBER MATS, AND FIBER MATS AND ARTICLES COMPRISING THEM | GEORGIA-PACIFIC CHEMICALS LLC (US) | 2009-05-14 | — | — | US | disclosed |
| WO-2005109098-A1 | PATTERN FORMING MATERIAL, PATTERN FORMING APPARATUS, AND PATTERN FORMING PROCESS | FUJI PHOTO FILM CO., LTD. (JP) | 2005-11-17 | — | — | WO | disclosed |
| US-6905637-B2 | Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom | GENERAL ELECTRIC COMPANY (US) | 2005-06-14 | — | — | US | disclosed |
| US-20020177027-A1 | Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2002-11-28 | — | — | US | disclosed |