SCHEMBL674471

SCHEMBL674471

CCCC[Sn+2]CCCC.O=C([O-])C(Cc1ccccc1)C(O)(Cc1ccccc1)C(=O)[O-]

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.39
ALPL P05186 1/20 0.39
ALPG P10696 1/20 0.39
CSNK1E P49674 1/20 0.35
KDM4E B2RXH2 1/20 0.35
MEN1 O00255 1/20 0.35
MAPT P10636 1/20 0.35
CYP2C9 P11712 1/20 0.35
CYP2C19 P33261 1/20 0.35
PTPN7 P35236 1/20 0.35
RECQL P46063 1/20 0.35
BLM P54132 1/20 0.35
KMT2A Q03164 1/20 0.35
HSD17B10 Q99714 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
CTSK P43235 5/20 0.33
CTSL P07711 2/20 0.33
CTSB P07858 2/20 0.33
MMP1 P03956 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL674006 0.95 CSNK1E (0.39) POLBALPLALPGCSNK1EMEN1
SCHEMBL675407 0.84 POLB (0.40) POLBALPLALPGKDM4EMEN1
SCHEMBL673481 0.83 POLB (0.40) POLBALPLALPGKDM4EMEN1
SCHEMBL675637 0.83 POLB (0.42) POLBALPLALPGKDM4EMEN1
SCHEMBL673685 0.83 POLB (0.42) POLBALPLALPGKDM4EMEN1
SCHEMBL672704 0.81 POLB (0.40) POLBALPLALPGKDM4EMEN1
SCHEMBL755930 0.71 CA2 (0.35)
SCHEMBL674032 0.71 HDAC3 (0.42) MEN1KMT2AMMP1MMP9MMP13
SCHEMBL673597 0.70 HSPD1 (0.40) CSNK1EBLMMMP1CNR2
Diphenylacetic Acid SCHEMBL28335138 0.69 TDP1 (0.42) POLBKDM4EMEN1MAPTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240262965-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF KANEKA CORPORATION (JP) 2024-08-08 US disclosed
WO-2023068083-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-04-27 WO disclosed
WO-2023013487-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-02-09 WO disclosed
WO-2021256180-A1 URETHANE ADHESIVE COMPOSITION シーカ・ハマタイト株式会社 2021-12-23 WO disclosed
US-20210087438-A1 ADHESIVE COMPOSITION FOR BATTERIES AND ADHESIVE MEMBER FOR BATTERIES USING SAME TOAGOSEI CO., LTD. (JP) 2021-03-25 US disclosed
CN-111989379-A Building with wall structure and method for manufacturing wall structure 思美定株式会社 2020-11-24 CN disclosed
WO-2019203034-A1 BUILDING HAVING WALL STRUCTURE AND METHOD FOR PRODUCING WALL STRUCTURE セメダイン株式会社 2019-10-24 WO disclosed
EP-3178872-B1 MODIFIED SILICONE RESIN FOAMED BODY KANEKA CORP (JP) 2019-06-19 EP disclosed
US-10131722-B2 Method for preparing terminal-modified conjugated diene polymer, terminal-modified conjugated diene polymer, rubber composition and tire BRIDGESTONE CORPORATION (JP) 2018-11-20 US disclosed
US-20170275400-A1 METHOD FOR PREPARING TERMINAL-MODIFIED CONJUGATED DIENE POLYMER, TERMINAL-MODIFIED CONJUGATED DIENE POLYMER, RUBBER COMPOSITION AND TIRE BRIDGESTONE CORPORATION (JP) 2017-09-28 US disclosed
US-20060135709-A1 Curing composition KANEKA CORPORATION (JP) 2006-06-22 US disclosed
EP-1642932-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-04-05 EP disclosed
EP-1637565-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-03-22 EP disclosed
EP-1619219-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2006-01-25 EP disclosed
EP-1057861-B1 Use of a crosslinked product as a heat-sensitive elastic adhesive KANEKA CORP (JP) 2004-11-24 EP disclosed
EP-1004628-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2004-02-25 EP disclosed
US-6426392-B1 REACTING/CROSSLINKING ISOBUTYLENE AND DIALKYLTIN DIALKOXIDE; FOR USE AS SEALING; WORKABILITY, MATERIALS HANDLING; RECYCLABILITY; HIGH STRESS RELAXATION AND LOW MEMORY CHARACTERISTICS KANEKA CORPORATION (JP) 2002-07-30 US disclosed
US-6335412-B1 POLYSILOXANE-MODIFIED ISOBUTYLENE POLYMERS AS SEALANTS KANEKA CORPORATION (JP) 2002-01-01 US disclosed
EP-1057861-A2 Thermoplastic crosslinked product and heat-sensitive elastic adhesive KANEKA CORPORATION (JP) 2000-12-06 EP disclosed
EP-1004628-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2000-05-31 EP disclosed