SCHEMBL6745877

SCHEMBL6745877

COC(=O)CCc1cc(C(C)(C)C)c(OC(c2c(C(C)(C)C)cc(CCC(=O)OC)cc2C(C)(C)C)C(CO)(CO)CO)c(C(C)(C)C)c1

nearest known ligand 0.40

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
GAA P10253 4/20 0.40
VCAM1 P19320 6/20 0.39
KMT2A Q03164 3/20 0.38
MEN1 O00255 2/20 0.35
PTPN1 P18031 1/20 0.33
MAPT P10636 1/20 0.33
ADRB2 P07550 1/20 0.33
ADRB1 P08588 1/20 0.33
MAOA P21397 1/20 0.32
MAOB P27338 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10577735 0.86 CNR2 (0.36) GAAKMT2A
SCHEMBL6747519 0.83 CNR2 (0.40)
SCHEMBL10607967 0.83 CNR2 (0.40)
SCHEMBL35210200 0.81 GAA (0.47) GAAVCAM1KMT2AMEN1PTPN1
SCHEMBL4659187 0.81 CNR2 (0.38)
SCHEMBL10774866 0.80 THRB (0.35) VCAM1
SCHEMBL10536720 0.80 CA12 (0.35) GAAMAPT
SCHEMBL499915 0.79 HSPA5 (0.40) KMT2AMEN1
SCHEMBL27658040 0.78 MEN1 (0.33) KMT2AMEN1
SCHEMBL6059057 0.78 PTGS2 (0.38)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0186628-B1 PENTAERYTHRITDIPHOSPHITES, PROCESS FOR THEIR PREPARATION AND THEIR USE AS STABILIZERS CIBA-GEIGY AG (CH) 1989-12-13 EP claimed
JP-6279656-A None JP disclosed
CN-116848467-A Photosensitive resin composition, cured film, and semiconductor device 住友电木株式会社 2023-10-03 CN disclosed
CN-110914756-B Photosensitive resin composition, resin film, and electronic device 住友电木株式会社 2021-05-04 CN disclosed
CN-112689800-A Photosensitive resin composition for forming permanent film, cured film, electronic device, method for producing cured film, and method for producing electronic device 住友电木株式会社 2021-04-20 CN disclosed
CN-110809737-B Photosensitive resin composition, resin film, and electronic device 住友电木株式会社 2020-11-17 CN disclosed
CN-111094531-A Biochemical instrument 日本瑞翁株式会社 2020-05-01 CN disclosed
CN-110914756-A Photosensitive resin composition, resin film, and electronic device 住友电木株式会社 2020-03-24 CN disclosed
CN-110809737-A Photosensitive resin composition, resin film, and electronic device 住友电木株式会社 2020-02-18 CN disclosed
CN-104252102-B Negative light-sensitive resin combination, cured film, electronic device and polymer 住友电木株式会社 2019-11-26 CN disclosed
US-6790914-B2 TRANSPARENT (CROSSLINKED) RESIN FILM CAN BE USED AS A POLARIZING FILM, SURFACE PROTECTIVE FILM, RETARDATION FILM, TRANSPARENT CONDUCTIVE FILM, LIGHT DIFFUSION FILM, FILM FOR AN EL DISPLAY DEVICE, TRANSPARENT CONDUCTIVE COMPOSITE MATERIAL, JSR CORPORATION (JP) 2004-09-14 US disclosed
US-20040106740-A1 Resin film and applications thereof JSR CORPORATION (JP) 2004-06-03 US disclosed
EP-1195397-B1 Composition of cyclic olefin addition copolymer and cross-linked material JSR CORP (JP) 2004-04-14 EP disclosed
US-20020042461-A1 Composition of cyclic olefin addition copolymer and cross-linked material JSR CORPORATION (JP) 2002-04-11 US disclosed
EP-1195397-A1 Composition of cyclic olefin addition copolymer and cross-linked material JSR Corporation (JP) 2002-04-10 EP disclosed
JP-H06279656-A HEAT-RESISTANT RESIN COMPOSITION JAPAN SYNTHETIC RUBBER CO LTD 1994-10-04 JP disclosed