SCHEMBL6753933

SCHEMBL6753933

CCC(C)c1nc2c(C)c(C)ccc2[nH]1

nearest known ligand 0.42

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CBFB Q13951 1/20 0.42
PARP1 P09874 5/20 0.37
ADAMTS5 Q9UNA0 1/20 0.36
EGLN1 Q9GZT9 1/20 0.36
NPC1 O15118 1/20 0.36
RAB9A P51151 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
SCN10A Q9Y5Y9 1/20 0.35
OPRM1 P35372 1/20 0.33
ELANE P08246 1/20 0.33
RPS6KA3 P51812 1/20 0.32
HPSE Q9Y251 1/20 0.32
HRH4 Q9H3N8 1/20 0.31
PDE2A O00408 1/20 0.31
PDE3B Q13370 1/20 0.31
PDE3A Q14432 1/20 0.31
P2RY12 Q9H244 1/20 0.31
AAK1 Q2M2I8 1/20 0.31
CYP1A2 P05177 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6757190 0.83 CBFB (0.46) CBFBPARP1ADAMTS5EGLN1NPC1
SCHEMBL6756257 0.81 PARP1 (0.46) CBFBPARP1
SCHEMBL6756285 0.78 CBFB (0.38) CBFBPARP1ADAMTS5EGLN1NPC1
SCHEMBL6753935 0.74 SCN10A (0.38) SCN10APDE2APDE3BPDE3AP2RY12
SCHEMBL11019201 0.73 CBFB (0.41) CBFBPARP1ADAMTS5EGLN1NPC1
SCHEMBL9847093 0.73 CBFB (0.46) CBFBADAMTS5EGLN1NPC1RAB9A
SCHEMBL6756153 0.72 KDM4E (0.44) CBFBADAMTS5EGLN1NPC1RAB9A
SCHEMBL353026 0.71 CBFB (0.51) CBFBPARP1ADAMTS5EGLN1NPC1
SCHEMBL12727236 0.71 CYP1A2 (0.50) SMN1; SMN2SCN10AAAK1CYP1A2
SCHEMBL12402507 0.71 HSD17B10 (0.38) CBFBPARP1EGLN1RPS6KA3CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 EP claimed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP claimed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US claimed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP claimed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP claimed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 US disclosed
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 EP disclosed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP disclosed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP disclosed