SCHEMBL6756153

SCHEMBL6756153

Cc1ccc2[nH]c(CC(C)C)nc2c1C

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KDM4E B2RXH2 1/20 0.44
▸ MAPT P10636 1/20 0.44
▸ CBFB Q13951 1/20 0.43
▸ OPRM1 P35372 1/20 0.41
▸ ADAMTS5 Q9UNA0 1/20 0.37
▸ EGLN1 Q9GZT9 1/20 0.37
▸ NPC1 O15118 2/20 0.36
▸ RAB9A P51151 2/20 0.36
▸ SMN1; SMN2 Q16637 1/20 0.36
▸ GSK3B P49841 1/20 0.36
▸ ADORA3 P0DMS8 1/20 0.35
▸ ADORA2A P29274 1/20 0.35
▸ ADORA2B P29275 1/20 0.35
▸ ADORA1 P30542 1/20 0.35
▸ PARP14 Q460N5 1/20 0.35
▸ PARP10 Q53GL7 1/20 0.35
▸ PARP11 Q9NR21 1/20 0.35
▸ PARP2 Q9UGN5 1/20 0.35
▸ PRKCZ Q05513 1/20 0.34
▸ TSHR P16473 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6753981 0.84 AAK1 (0.45) CBFBOPRM1ADAMTS5EGLN1NPC1
SCHEMBL6755247 0.81 GPR84 (0.43) CBFBOPRM1ADAMTS5EGLN1NPC1
SCHEMBL9847093 0.81 CBFB (0.46) CBFBOPRM1ADAMTS5EGLN1NPC1
SCHEMBL4105591 0.80 MGAM (0.46) KDM4EMAPTCBFBALDH1A1GAA
SCHEMBL23227712 0.79 CBFB (0.45) KDM4EMAPTCBFBOPRM1ADAMTS5
SCHEMBL4069917 0.79 CBFB (0.45) KDM4ECBFBOPRM1ADAMTS5EGLN1
SCHEMBL5738714 0.79 CBFB (0.45) CBFBOPRM1ADAMTS5EGLN1NPC1
SCHEMBL6757251 0.78 CBFB (0.44) KDM4ECBFBOPRM1ADAMTS5EGLN1
SCHEMBL6755343 0.78 CBFB (0.44) CBFBOPRM1ADAMTS5EGLN1NPC1
SCHEMBL6759191 0.75 GAA (0.54) KDM4EMAPTCBFBNPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 — — EP claimed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 — — EP claimed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 — — US claimed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 — — EP claimed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 — — EP claimed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 — — US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 — — US disclosed
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 — — EP disclosed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 — — EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 — — US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 — — EP disclosed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 — — EP disclosed
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