SCHEMBL6753940

SCHEMBL6753940

Cc1cccc2[nH]c(CCCC(C)C)nc12

nearest known ligand 0.47

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 1/20 0.43
MGAM O43451 12/20 0.42
GAA P10253 12/20 0.42
SI P14410 12/20 0.42
MGAM2 Q2M2H8 12/20 0.42
POLB P06746 1/20 0.41
ALDH1A1 P00352 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
ESR1 P03372 1/20 0.40
CBFB Q13951 1/20 0.40
PARP1 P09874 1/20 0.39
PARP2 Q9UGN5 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6756268 0.91 AAK1 (0.45) MGAMGAASIMGAM2ALDH1A1
SCHEMBL6755252 0.83 MGAM (0.45) MGAMGAASIMGAM2POLB
SCHEMBL6755247 0.82 GPR84 (0.43) GPR84POLBCBFB
SCHEMBL6753968 0.82 POLB (0.47) MGAMGAASIMGAM2POLB
SCHEMBL4105591 0.81 MGAM (0.46) MGAMGAASIMGAM2ALDH1A1
SCHEMBL6759162 0.81 POLB (0.46) GPR84MGAMGAASIMGAM2
SCHEMBL6756127 0.81 POLB (0.46) GPR84MGAMGAASIMGAM2
SCHEMBL6759161 0.81 POLB (0.46) GPR84MGAMGAASIMGAM2
SCHEMBL6756152 0.81 POLB (0.46) GPR84MGAMGAASIMGAM2
SCHEMBL6757245 0.81 POLB (0.46) GPR84MGAMGAASIMGAM2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 EP claimed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP claimed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US claimed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP claimed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP claimed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 US disclosed
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 EP disclosed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP disclosed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP disclosed