SCHEMBL6756268

SCHEMBL6756268

Cc1cccc2[nH]c(CCC(C)C)nc12

nearest known ligand 0.50

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
AAK1 Q2M2I8 2/20 0.45
MGAM O43451 13/20 0.44
GAA P10253 13/20 0.44
SI P14410 13/20 0.44
MGAM2 Q2M2H8 13/20 0.44
ALDH1A1 P00352 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
ESR1 P03372 1/20 0.42
CBFB Q13951 1/20 0.42
PARP1 P09874 1/20 0.41
PARP2 Q9UGN5 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6753940 0.91 GPR84 (0.43) MGAMGAASIMGAM2ALDH1A1
SCHEMBL4105591 0.84 MGAM (0.46) MGAMGAASIMGAM2ALDH1A1
SCHEMBL7608595 0.83 PSMB8 (0.45) AAK1MGAMGAASIMGAM2
SCHEMBL1917210 0.82 MGAM (0.47) MGAMGAASIMGAM2ALDH1A1
SCHEMBL6753981 0.81 AAK1 (0.45) AAK1ALDH1A1CBFBPARP2
SCHEMBL4359045 0.80 MGAM (0.51) MGAMGAASIMGAM2ALDH1A1
SCHEMBL6755252 0.79 MGAM (0.45) MGAMGAASIMGAM2ALDH1A1
SCHEMBL4919548 0.78 DDAH1 (0.55) MGAMGAASIMGAM2ALDH1A1
SCHEMBL30518181 0.78 DDAH1 (0.55) MGAMGAASIMGAM2ALDH1A1
SCHEMBL6753968 0.78 POLB (0.47) MGAMGAASIMGAM2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 EP claimed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP claimed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US claimed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP claimed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 US disclosed
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 EP disclosed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US disclosed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP disclosed