SCHEMBL6755343

SCHEMBL6755343

Cc1ccc2[nH]c(CC(C)(C)C)nc2c1C

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CBFB Q13951 1/20 0.44
▸ OPRM1 P35372 1/20 0.42
▸ ADAMTS5 Q9UNA0 1/20 0.38
▸ EGLN1 Q9GZT9 1/20 0.38
▸ NPC1 O15118 2/20 0.37
▸ RAB9A P51151 2/20 0.37
▸ SMN1; SMN2 Q16637 1/20 0.37
▸ RPS6KA3 P51812 1/20 0.36
▸ ALDH1A1 P00352 1/20 0.36
▸ GAA P10253 1/20 0.36
▸ CACNA1H O95180 2/20 0.35
▸ CACNA1C Q13936 2/20 0.35
▸ CACNA1G O43497 1/20 0.35
▸ PARP14 Q460N5 1/20 0.35
▸ PARP10 Q53GL7 1/20 0.35
▸ PARP11 Q9NR21 1/20 0.35
▸ PARP2 Q9UGN5 1/20 0.35
▸ PTGES O14684 1/20 0.34
▸ CACNA1B Q00975 1/20 0.33
▸ HRH4 Q9H3N8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9847093 0.82 CBFB (0.46) CBFBOPRM1ADAMTS5EGLN1NPC1
SCHEMBL6757129 0.81 MGAM (0.46) CBFBALDH1A1GAACACNA1H
SCHEMBL23227712 0.81 CBFB (0.45) CBFBOPRM1ADAMTS5EGLN1NPC1
SCHEMBL4069917 0.81 CBFB (0.45) CBFBOPRM1ADAMTS5EGLN1NPC1
SCHEMBL5738714 0.81 CBFB (0.45) CBFBOPRM1ADAMTS5EGLN1NPC1
SCHEMBL6757251 0.79 CBFB (0.44) CBFBOPRM1ADAMTS5EGLN1NPC1
SCHEMBL6756153 0.78 KDM4E (0.44) CBFBOPRM1ADAMTS5EGLN1NPC1
SCHEMBL6756137 0.77 CBFB (0.42) CBFBOPRM1ADAMTS5ALDH1A1
SCHEMBL6759191 0.77 GAA (0.54) CBFBNPC1RAB9AALDH1A1GAA
SCHEMBL6756143 0.76 CBFB (0.41) CBFBOPRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 — — EP claimed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 — — EP claimed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 — — US claimed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 — — EP claimed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 — — EP claimed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 — — US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 — — US disclosed
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 — — EP disclosed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 — — EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 — — US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 — — EP disclosed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 — — EP disclosed
Send feedback