⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28890938 | 0.82 | — | — | |
| SCHEMBL11031233 | 0.79 | MAPK1 (0.31) | — | |
| SCHEMBL9156371 | 0.75 | MMP1 (0.31) | — | |
| SCHEMBL77793 | 0.74 | SLC1A3 (0.31) | — | |
| SCHEMBL20471153 | 0.71 | LMNA (0.36) | — | |
| SCHEMBL134615 | 0.69 | TSHR (0.36) | — | |
| SCHEMBL3801500 | 0.68 | MAPK1 (0.31) | — | |
| SCHEMBL6690069 | 0.68 | ALDH1A1 (0.33) | — | |
| SCHEMBL9650150 | 0.67 | TSHR (0.30) | — | |
| SCHEMBL532843 | 0.67 | TSHR (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114656788-A | Cyclic imide resin composition, prepreg, copper-clad laminate, and printed circuit board | 信越化学工业株式会社 | 2022-06-24 | — | — | CN | disclosed |
| CN-105713144-B | The co-crosslinker system for packaging film comprising bis- (eneamide) compounds | 赢创德固赛有限公司 | 2019-08-06 | — | — | CN | disclosed |
| CN-105713146-B | The co-crosslinker system for packaging film comprising (methyl) acrylamide compound | 赢创德固赛有限公司 | 2019-06-21 | — | — | CN | disclosed |
| US-8062557-B2 | Thermoplastic resin composition for producing automobile exterior parts | DSM IP ASSETS B.V. (NL) | 2011-11-22 | — | — | US | disclosed |
| US-7981511-B2 | Hollow resin fine particles, organic/inorganic hybrid fine particles, and method for producing hollow resin fine particles | SEKISUI CHEMICAL CO., LTD. (JP) | 2011-07-19 | — | — | US | disclosed |
| US-20090309073-A1 | THERMOPLASTIC RESIN COMPOSITION FOR PRODUCING AUTOMOBILE EXTERIOR PARTS | DSM IP ASSETS B.V. (NL) | 2009-12-17 | — | — | US | disclosed |
| EP-2028230-A1 | THERMOPLASTIC RESIN COMPOSITION FOR PRODUCING AUTOMOBILE EXTERIOR PART | Mitsubishi Engineering-Plastics Corporation (JP) | 2009-02-25 | — | — | EP | disclosed |
| US-20070251422-A1 | Hollow Resin Fine Particles, Organic/Inorganic Hybrid Fine Particles, and Method for Producing Hollow Resin Fine Particles | SEKISUI CHEMICAL CO., LTD. (JP) | 2007-11-01 | — | — | US | disclosed |
| EP-1739116-A1 | HOLLOW RESIN FINE PARTICLES, ORGANIC/INORGANIC HYBRID FINE PARTICLES, AND METHOD FOR PRODUCING HOLLOW RESIN FINE ARTICLES | SEKISUI CHEMICAL CO., LTD. (JP) | 2007-01-03 | — | — | EP | disclosed |