SCHEMBL676240

SCHEMBL676240

CO[Si](C)(CCCC(=O)C(C)=C(C)C)OC

nearest known ligand 0.30

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CES1 P23141 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL465121 0.81 ALDH1A1 (0.37) CES1
SCHEMBL18419462 0.76 ALDH1A1 (0.35) CES1
SCHEMBL27499341 0.75 MEN1 (0.32)
SCHEMBL3503024 0.75 TSHR (0.46)
SCHEMBL4443236 0.71
SCHEMBL28160499 0.69
Acetone SCHEMBL28537834 0.69 PAOX (0.38)
SCHEMBL28790367 0.69 CYP1A2 (0.38)
SCHEMBL3904651 0.69 TBXAS1 (0.35)
SCHEMBL1305038 0.69 ALDH1A1 (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2158283-B1 MOISTURE-CURABLE, GRAFT-MODIFIED RESIN COMPOSITION, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR BONDING SUBSTRATES EMPLOYING THE RESIN COMPOSITION MOMENTIVE PERFORMANCE MAT INC (US) 2017-10-18 EP claimed
US-8063140-B2 Moisture-curable, graft-modified resin composition, process for its manufacture and process for bonding substrates employing the resin composition MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2011-11-22 US claimed
EP-2158283-A1 MOISTURE-CURABLE, GRAFT-MODIFIED RESIN COMPOSITION, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR BONDING SUBSTRATES EMPLOYING THE RESIN COMPOSITION Momentive Performance Materials Inc. (US) 2010-03-03 EP claimed
WO-2008156611-A1 MOISTURE-CURABLE, GRAFT-MODIFIED RESIN COMPOSITION, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR BONDING SUBSTRATES EMPLOYING THE RESIN COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-12-24 WO claimed
US-20080311419-A1 Moisture-curable, graft-modified resin composition, process for its manufacture and process for bonding substrates employing the resin composition MOMENTIVE PERFORMANCE MATERIALS INC. 2008-12-18 US claimed
EP-2158283-B1 MOISTURE-CURABLE, GRAFT-MODIFIED RESIN COMPOSITION, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR BONDING SUBSTRATES EMPLOYING THE RESIN COMPOSITION MOMENTIVE PERFORMANCE MAT INC (US) 2017-10-18 EP disclosed
US-8063140-B2 Moisture-curable, graft-modified resin composition, process for its manufacture and process for bonding substrates employing the resin composition MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2011-11-22 US disclosed
EP-2158283-A1 MOISTURE-CURABLE, GRAFT-MODIFIED RESIN COMPOSITION, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR BONDING SUBSTRATES EMPLOYING THE RESIN COMPOSITION Momentive Performance Materials Inc. (US) 2010-03-03 EP disclosed
WO-2008156611-A1 MOISTURE-CURABLE, GRAFT-MODIFIED RESIN COMPOSITION, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR BONDING SUBSTRATES EMPLOYING THE RESIN COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-12-24 WO disclosed
US-20080311419-A1 Moisture-curable, graft-modified resin composition, process for its manufacture and process for bonding substrates employing the resin composition MOMENTIVE PERFORMANCE MATERIALS INC. 2008-12-18 US disclosed