SCHEMBL465121

SCHEMBL465121

C=C(C)C(=O)CCC[Si](C)(OC)OC

nearest known ligand 0.37

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.37
TSHR P16473 3/20 0.32
CES1 P23141 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18419462 0.94 ALDH1A1 (0.35) ALDH1A1TSHRCES1
SCHEMBL18419469 0.88 ALDH1A1 (0.39) ALDH1A1TSHR
SCHEMBL7943777 0.85 TSHR (0.32) ALDH1A1TSHRCES1
SCHEMBL21834013 0.82 ALDH1A1 (0.33) ALDH1A1CES1
SCHEMBL37161 0.82 ALDH1A1 (0.33) ALDH1A1CES1
SCHEMBL1306312 0.81 CES1 (0.32) TSHRCES1
SCHEMBL11212415 0.81 ALDH1A1 (0.32) ALDH1A1CES1
SCHEMBL676240 0.81 CES1 (0.30) CES1
SCHEMBL565537 0.79 CES1 (0.34) CES1
SCHEMBL15469253 0.79 CES2 (0.31) ALDH1A1TSHRCES1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2158283-B1 MOISTURE-CURABLE, GRAFT-MODIFIED RESIN COMPOSITION, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR BONDING SUBSTRATES EMPLOYING THE RESIN COMPOSITION MOMENTIVE PERFORMANCE MAT INC (US) 2017-10-18 EP claimed
EP-2157139-B1 A METHOD FOR MODIFYING NORMAL CLAY AND A METHOD FOR PRODUCING COMPOSITE ELASTOMER FROM THE CLAY SHI LEI (CN) 2014-03-26 EP claimed
US-8063140-B2 Moisture-curable, graft-modified resin composition, process for its manufacture and process for bonding substrates employing the resin composition MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2011-11-22 US claimed
EP-2158283-A1 MOISTURE-CURABLE, GRAFT-MODIFIED RESIN COMPOSITION, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR BONDING SUBSTRATES EMPLOYING THE RESIN COMPOSITION Momentive Performance Materials Inc. (US) 2010-03-03 EP claimed
WO-2008156611-A1 MOISTURE-CURABLE, GRAFT-MODIFIED RESIN COMPOSITION, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR BONDING SUBSTRATES EMPLOYING THE RESIN COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-12-24 WO claimed
US-20080311419-A1 Moisture-curable, graft-modified resin composition, process for its manufacture and process for bonding substrates employing the resin composition MOMENTIVE PERFORMANCE MATERIALS INC. 2008-12-18 US claimed
CN-120202243-A Thermosetting resin composition, cured film, substrate, and electronic component 捷恩智株式会社 2025-06-24 CN disclosed
CN-119998382-A Flame retardant compositions comprising polycycloolefinic polymers containing olefinic functionality for forming low loss films with improved dielectric and thermal properties 普罗米鲁斯有限责任公司 2025-05-13 CN disclosed
CN-115356873-B Resin composition, light-shielding film, method for producing light-shielding film, and substrate with barrier ribs 东丽株式会社 2025-04-25 CN disclosed
WO-2024150597-A1 THERMOSETTING RESIN COMPOSITION, CURED FILM, SUBSTRATE, AND ELECTRONIC COMPONENT JNC株式会社 2024-07-18 WO disclosed
CN-117957494-A Resin composition, light-shielding film, and substrate with partition wall 东丽株式会社 2024-04-30 CN disclosed
CN-117858927-A Silicone resin composition for forming cured film, and method for producing polysiloxane 东丽株式会社 2024-04-09 CN disclosed
CN-115427514-B Resin composition, light-shielding film, and substrate with partition wall 东丽株式会社 2024-01-02 CN disclosed
US-6946498-B2 Coating composition and article coated with the composition NIPPON ARC CO., LTD. (JP) 2005-09-20 US disclosed
US-20040167280-A1 Coating composition and article coated with the composition SDC TECHNOLOGIES, INC. 2004-08-26 US disclosed
EP-1418211-A1 COATING COMPOSITION AND ARTICLE COATED WITH THE COMPOSITION NIPPON ARC CO., LTD. (JP) 2004-05-12 EP disclosed
EP-0628605-B1 Moisture - or anaerobic-curable and photocurable silicone compositions THREE BOND CO LTD (JP) 1999-08-04 EP disclosed
EP-0838506-A1 Paint film for outside plates, coating composition, film forming method, and coated article Nippon Paint Co., Ltd. (JP) 1998-04-29 EP disclosed
US-5489622-A POLYSILOXANE, HAVING AMINO END GROUPS, REACTED WITH UNSATURATED ISOCYANATE AND MIXED WITH CURING AND PHOTOPOLYMERIZATION CATALYSTS THREE BOND CO., LTD. (JP) 1996-02-06 US disclosed
EP-0628605-A2 Moisture - or anaerobic-curable and photocurable silicone compositions THREE BOND CO., LTD. (JP) 1994-12-14 EP disclosed