SCHEMBL6764165

SCHEMBL6764165

COc1ccc(OS(=O)(=O)C(F)(F)F)c(-c2ccccc2)c1-c1ccccc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.43
MEN1 O00255 2/20 0.43
ALDH1A1 P00352 2/20 0.43
KMT2A Q03164 2/20 0.43
KDM4E B2RXH2 2/20 0.43
USP2 O75604 1/20 0.43
DUSP3 P51452 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
FABP3 P05413 1/20 0.40
FABP4 P15090 1/20 0.40
FABP5 Q01469 1/20 0.40
DRD2 P14416 4/20 0.38
ACLY P53396 3/20 0.37
MAPK1 P28482 2/20 0.37
RAB9A P51151 2/20 0.37
NPSR1 Q6W5P4 2/20 0.37
ADORA2A P29274 2/20 0.37
FGB P02675 1/20 0.37
POLB P06746 1/20 0.37
THRB P10828 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrogen Sulfide SCHEMBL27733891 0.98 MAPT (0.42) MAPTMEN1ALDH1A1KMT2AKDM4E
SCHEMBL6759609 0.86 ADORA2A (0.38) FABP4DRD2ADORA2AADORA1PDE4A
SCHEMBL2498662 0.83 ADORA2A (0.37) MAPTDRD2NPSR1ADORA2AADORA1
SCHEMBL10062806 0.83 DRD2 (0.42) DRD2ADORA2AADORA1PDE4APDE4C
SCHEMBL27796343 0.82 MAPT (0.63) MAPTMEN1ALDH1A1KMT2AKDM4E
SCHEMBL5904279 0.82 BACE1 (0.46) MEN1KMT2ADRD2RAB9A
SCHEMBL28568213 0.81 DRD2 (0.46) MAPTMEN1ALDH1A1KMT2AKDM4E
SCHEMBL5599606 0.81 CA1 (0.50) ALDH1A1KMT2ADRD2MAPK1POLB
SCHEMBL29414143 0.81 CA1 (0.50) ALDH1A1KMT2ADRD2MAPK1POLB
SCHEMBL8636736 0.80 IDO1 (0.46) ALDH1A1FABP4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118047908-A Hydrophobic ion elastomer and preparation method thereof 福建理工大学 2024-05-17 CN claimed
CN-1249524-C Photoresist composition for etch-resistant agent flowing process and method for forming contact hole using the same HYUNDAI ELECTRONICS IND (KR) 2006-04-05 CN claimed
CN-1217232-C Monomer for cross-linkage agent containing double bond and photoresist copolymer containing same HYUNDAI ELECTRONICS IND (JP) 2005-08-31 CN claimed
US-6749990-B2 UNSATURATED HALOGENATED HYDROCARBON AS PHOTORESIST MONOMER, FOR EXAMPLE 3,3,4,4,5,5,6,6,6-NONAFLUORO-1-HEXENE; ETCHING RESISTANCE, HEAT RESISTANCE AND ADHESIVENESS, AND IS DEVELOPABLE IN AQUEOUS TETRAMETHYLAMMONIUM HYDROXIDE HYNIX SEMICONDUCTOR INC. (KR) 2004-06-15 US claimed
US-20030017404-A1 Chemical amplification photoresist monomers, polymers therefrom and photoresist compositions containing the same HYNIX SEMICONDUCTOR INC. (KR) 2003-01-23 US claimed
CN-1285529-A Monomer for cross-linkage agent containing double bond and photoresist copolymer containing same HYUNDAI ELECTRONICS IND (JP) 2001-02-28 CN claimed
CN-1255652-A Cross linking agent for photoslushing compound, and photoslushing compound compsns. containing same cross linking agent HYUNDAI ELECTRONICS IND (KR) 2000-06-07 CN claimed
CN-1255653-A Cross linking agent for photoslushing compound, and photoslushing compound compsns. containing same cross linking agent HYUNDAI ELECTRONICS IND (KR) 2000-06-07 CN claimed
CN-114131923-B Method for producing polyurethane three-dimensional objects from materials having multiple hardening mechanisms 卡本有限公司 2024-05-24 CN disclosed
CN-118047908-A Hydrophobic ion elastomer and preparation method thereof 福建理工大学 2024-05-17 CN disclosed
CN-117624491-A Self-repairing dual-curing photosensitive resin material and preparation method thereof 福建理工大学 2024-03-01 CN disclosed
CN-115195104-B Dual precursor resin system for additive manufacturing with dual cure resins 卡本有限公司 2023-12-05 CN disclosed
CN-112867601-B Method for producing spatially varying dielectric materials, articles produced by the method and use thereof 罗杰斯公司 2023-11-17 CN disclosed
CN-108139665-B Dual precursor resin system for additive manufacturing with dual cure resins 卡本有限公司 2022-07-05 CN disclosed
US-20030017404-A1 Chemical amplification photoresist monomers, polymers therefrom and photoresist compositions containing the same HYNIX SEMICONDUCTOR INC. (KR) 2003-01-23 US disclosed
US-20020164541-A1 Maleimide-photoresist polymers containing fluorine and photoresist compositions comprising the same HYNIX SEMICONDUCTOR, INC. (KR) 2002-11-07 US disclosed
CN-1285529-A Monomer for cross-linkage agent containing double bond and photoresist copolymer containing same HYUNDAI ELECTRONICS IND (JP) 2001-02-28 CN disclosed
CN-1264060-A Photoresist composition with excellent anti-back-exposure delayeed effect HYUNDAI ELECTRONICS IND (KR) 2000-08-23 CN disclosed
CN-1255653-A Cross linking agent for photoslushing compound, and photoslushing compound compsns. containing same cross linking agent HYUNDAI ELECTRONICS IND (KR) 2000-06-07 CN disclosed
CN-1255652-A Cross linking agent for photoslushing compound, and photoslushing compound compsns. containing same cross linking agent HYUNDAI ELECTRONICS IND (KR) 2000-06-07 CN disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20030017404-A1 Chemical amplification photoresist monomers, polymers therefrom and photoresist compositions containing the same ETV6, UFM1, UTS2R MAPT 330/4885MEN1 972/4885ALDH1A1 310/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.