SCHEMBL677243

SCHEMBL677243

CCC1(CC)CCC(=O)OC1=O

nearest known ligand 0.52

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11124048 0.83 TSHR (0.33) TSHR
SCHEMBL5906887 0.79 TSHR (0.44) TSHR
SCHEMBL10396229 0.78 ALDH1A1 (0.32) TSHR
SCHEMBL3211235 0.77 KDM4E (0.33) TSHR
SCHEMBL7456744 0.77 TSHR (0.36) TSHR
SCHEMBL27944809 0.76 KDM4E (0.32) TSHR
SCHEMBL28327230 0.73
SCHEMBL12996650 0.71
SCHEMBL134403 0.70 TSHR (0.41) TSHR
SCHEMBL8851822 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 190 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250294930-A1 SOLVENT-FREE THERMOSETTING QUANTUM DOT RESIN COMPOSITION, QUANTUM DOT RESIN COMPOSITE PREPARED THEREFROM, AND LED PACKAGE AND DISPLAY DEVICE EMPLOYING SAME HANSOL CHEMICAL CO., LTD. (KR) 2025-09-18 US claimed
EP-4516832-A1 SOLVENT-FREE THERMOSETTING QUANTUM DOT RESIN COMPOSITION, QUANTUM DOT RESIN COMPOSITE PREPARED THEREFROM, AND LED PACKAGE AND DISPLAY DEVICE EMPLOYING SAME Hansol Chemical Co., Ltd. (KR) 2025-03-05 EP claimed
CN-117603276-A Epoxy resin curing agent and preparation method and application thereof 上海玟昕科技有限公司 2024-02-27 CN claimed
CN-117586243-A Triglycidyl isocyanurate epoxy resin and preparation method and application thereof 上海玟昕科技有限公司 2024-02-23 CN claimed
WO-2023210935-A1 SOLVENT-FREE THERMOSETTING QUANTUM DOT RESIN COMPOSITION, QUANTUM DOT RESIN COMPOSITE PREPARED THEREFROM, AND LED PACKAGE AND DISPLAY DEVICE EMPLOYING SAME 주식회사 한솔케미칼 2023-11-02 WO claimed
CN-107849417-B Adhesive composition, cured product, semiconductor device, and method for producing same 昭和电工材料株式会社 2021-06-29 CN claimed
EP-2009145-B1 SEALER, MEMBERS COVERED WITH SPRAYED COATINGS, AND BEARINGS NTN TOYO BEARING CO LTD (JP) 2017-11-15 EP claimed
CN-106047059-A Powder coating with good weather resistance and method for preparing powder coating 合肥市燕美粉末涂料有限公司 2016-10-26 CN claimed
CN-105936800-A Powder paint for freezer shell and preparation method thereof 合肥市燕美粉末涂料有限公司 2016-09-14 CN claimed
CN-105925134-A Low-temperature-curing powder coating containing cerium oxide and preparation method thereof 合肥市燕美粉末涂料有限公司 2016-09-07 CN claimed
CN-105860766-A Low-temperature curing polyester/epoxy powder coating and preparation method thereof 合肥市燕美粉末涂料有限公司 2016-08-17 CN claimed
US-9387608-B2 Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-07-12 US claimed
US-9062380-B2 Pore sealing agent, member for coating spray deposit, and bearing NTN CORPORATION (JP) 2015-06-23 US claimed
US-20090245709-A1 PORE-SEALING AGENT, MEMBER FOR COATING SPRAY DEPOSIT, AND BEANING NTN CORPORATION (JP) 2009-10-01 US claimed
EP-2009145-A1 SEALER, MEMBERS COVERED WITH SPRAYED COATINGS, AND BEARINGS NTN CORPORATION (JP) 2008-12-31 EP claimed
US-20260085172-A1 POLYMERIZABLE COMPOSITION RESONAC CORP (JP) 2026-03-26 US disclosed
US-20260035498-A1 COPOLYMER AND RESIN COMPOSITION CONTAINING COPOLYMER KURARAY CO., LTD. (JP) 2026-02-05 US disclosed
US-5369110-A Hypotensive agents, cardiac insufficiency treatment CIBA-GEIGY CORPORATION (US) 1994-11-29 US disclosed
EP-0608132-A1 Coating varnish composition and antifouling coating composition HITACHI CHEMICAL CO., LTD. (JP) 1994-07-27 EP disclosed
EP-0490820-A2 Biphenylyl compounds CIBA-GEIGY AG (CH) 1992-06-17 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260085172-A1 POLYMERIZABLE COMPOSITION SMCHD1, CHD1, PAH TSHR 4056/4885
US-20260035498-A1 COPOLYMER AND RESIN COMPOSITION CONTAINING COPOLYMER EPB41, CCT4, COG4 TSHR 2640/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.