SCHEMBL677804

SCHEMBL677804

CCC(C)(C)c1[c]c(C(C)(C)CC)ccc1

nearest known ligand 0.38

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 3/20 0.33
RAB9A P51151 3/20 0.33
LMNA P02545 1/20 0.33
MAPK1 P28482 1/20 0.33
CASP3 P42574 1/20 0.33
ATM Q13315 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
SENP8 Q96LD8 1/20 0.33
SENP7 Q9BQF6 1/20 0.33
SENP6 Q9GZR1 1/20 0.33
GABRA1 P14867 1/20 0.32
GABRB2 P47870 1/20 0.32
MAPT P10636 1/20 0.31
POLB P06746 1/20 0.30
CYP2C9 P11712 1/20 0.30
TAAR1 Q96RJ0 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28517757 0.87 NPC1 (0.30) NPC1RAB9ALMNAMAPK1CASP3
SCHEMBL28977021 0.78 CNR2 (0.36)
SCHEMBL5969015 0.78
SCHEMBL2825666 0.75
SCHEMBL24071 0.75 NPC1 (0.34) NPC1RAB9ALMNAMAPK1CASP3
SCHEMBL23495993 0.73 ALDH1A1 (0.30) SMN1; SMN2POLB
SCHEMBL2498899 0.73 NPC1 (0.31) NPC1RAB9ALMNAMAPK1CASP3
SCHEMBL207429 0.73 CA2 (0.38) GABRA1GABRB2
SCHEMBL178139 0.72 RIPK1 (0.30)
SCHEMBL29213578 0.70 CA2 (0.36) GABRA1GABRB2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114746508-A Polyamide resin composition 宇部兴产株式会社 2022-07-12 CN disclosed
WO-2021111937-A1 POLYAMIDE RESIN COMPOSITION 宇部興産株式会社 2021-06-10 WO disclosed
CN-109021557-B Flame-retardant polyamide composite material and preparation method thereof 江苏金发科技新材料有限公司 2020-08-21 CN disclosed
CN-105838226-A Composition with which cured product having self-healing property is obtained and self-healing coat film having cured coating layer thereof 株式会社田村制作所 2016-08-10 CN disclosed
CN-104093748-B photocurable composition and hard coating agent ADEKA CORP. (JP) 2016-02-10 CN disclosed
US-9235117-B2 Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device, and electronic device FUJIFILM CORPORATION (JP) 2016-01-12 US disclosed
CN-105209576-A Flame-retardant composition and flame-retardant synthetic resin composition ADEKA CORP 2015-12-30 CN disclosed
CN-105209551-A Flame-retardant synthetic resin composition ADEKA CORP 2015-12-30 CN disclosed
CN-105102511-A Resin additive masterbatch and polyolefin resin composition containing the same ADEKA CORP 2015-11-25 CN disclosed
CN-103429600-B Novel cpd, near infrared ray absorption and the compound resin composition containing it ADEKA CORP. (JP) 2015-11-25 CN disclosed
US-6743565-B2 POLYSTYRENE OXY DERIVATIVES THAT DECOMPOSE UNDER AN ACID TO INCREASE THE SOLUBILITY IN AN ALKALI DEVELOPER AND AN ACID GENERATOR FUJI PHOTO FILM CO., LTD. (JP) 2004-06-01 US disclosed
US-6727033-B2 A POSITIVE RESIST COMPOSITION COMPRISING A RESIN (A), WHICH IS DECOMPOSED BY THE ACTION OF AN ACID TO INCREASE SOLUBILITY IN AN ALKALI DEVELOPING SOLUTION, CONTAINING A STRUCTURAL UNIT INCLUDING A GROUP REPRESENTED BY FORMULA (X) DEFINED IN FUJI PHOTO FILM CO., LTD. (JP) 2004-04-27 US disclosed
US-20040033437-A1 Radiation-sensitive composition FUJI PHOTO FILM CO., LTD. 2004-02-19 US disclosed
US-6692883-B2 GENERATING ACID; ADJUSTMENT SOLUBILITY IN ALKLAINE DEVELOPER FUJI PHOTO FILM CO., LTD. (JP) 2004-02-17 US disclosed
EP-1367439-A1 Radiation-sensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2003-12-03 EP disclosed
US-6630280-B1 Resin and compound that generates an arylsulfonic acid when exposed to actinic radiation; sensitivity; resolution; smoothness FUJI PHOTO FILM CO., LTD. (JP) 2003-10-07 US disclosed
US-20030134221-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-07-17 US disclosed
US-20030108811-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-06-12 US disclosed
US-20020012866-A1 Positive photoresist composition FUJIFILM CORPORATION (JP) 2002-01-31 US disclosed
US-6207343-B1 RESIN CONTAINING GROUPS WHICH DECOMPOSE BY THE ACTION OF AN ACID TO ENHANCE ITS SOLUBILITY IN AN ALKALINE DEVELOPING SOLUTION AND A COMPOUND WHICH GENERATES AN ACID UPON IRRADIATION WITH ACTINIC RAYS OR RADIATION FUJI PHOTO FILM CO., LTD. (JP) 2001-03-27 US disclosed