SCHEMBL677965

SCHEMBL677965

CNc1cc(C(c2ccc(O)c(NC(=O)c3cccc(C(C)=O)c3)c2)(C(F)(F)F)C(F)(F)F)ccc1O

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KCNMA1 Q12791 4/20 0.45
KMT2A Q03164 3/20 0.44
MEN1 O00255 2/20 0.44
PABPC1 P11940 1/20 0.44
DUSP3 P51452 1/20 0.44
PTPN5 P54829 1/20 0.44
PTPN11 Q06124 1/20 0.44
EIF4H Q15056 1/20 0.44
CTDSP1 Q9GZU7 1/20 0.44
RXFP1 Q9HBX9 1/20 0.43
MAPT P10636 3/20 0.42
HDAC1 Q13547 1/20 0.42
HDAC2 Q92769 1/20 0.42
NR1H4 Q96RI1 1/20 0.42
GAA P10253 4/20 0.41
NPC1 O15118 1/20 0.41
RAB9A P51151 1/20 0.41
CYP1A2 P05177 1/20 0.41
CYP3A4 P08684 1/20 0.41
CYP2D6 P10635 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14094877 0.93 KCNMA1 (0.45) KCNMA1KMT2AMEN1PABPC1DUSP3
SCHEMBL13955796 0.92 KCNMA1 (0.46) KCNMA1KMT2AMEN1PABPC1DUSP3
SCHEMBL1108309 0.91 KCNMA1 (0.45) KCNMA1KMT2AMEN1PABPC1DUSP3
SCHEMBL677917 0.90 KCNMA1 (0.46) KCNMA1KMT2AMEN1RXFP1MAPT
SCHEMBL13955816 0.89 KCNMA1 (0.57) KCNMA1KMT2AMEN1HDAC1HDAC2
SCHEMBL13955805 0.89 PTGS1 (0.45) KCNMA1KMT2AMEN1PABPC1DUSP3
SCHEMBL13741867 0.89 HDAC2 (0.46) KCNMA1KMT2AMEN1PABPC1DUSP3
SCHEMBL13155900 0.88 KCNMA1 (0.49) KCNMA1KMT2AMEN1PABPC1DUSP3
SCHEMBL676664 0.87 HDAC1 (0.47) KCNMA1KMT2AMEN1RXFP1HDAC1
SCHEMBL677398 0.87 KMT2A (0.48) KCNMA1KMT2AMEN1PABPC1DUSP3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8426504-B2 Hardenable epoxy resin composition ADEKA CORPORATION (JP) 2013-04-23 US disclosed
US-7906213-B2 Epoxy resin curable composition for prepreg ADEKA CORPORATION (JP) 2011-03-15 US disclosed
US-20100190899-A1 HARDENABLE EPOXY RESIN COMPOSITION ADEKA CORPORATION (JP) 2010-07-29 US disclosed
US-20090030147-A1 Epoxy Resin Curable Composition For Prepreg ADEKA CORPORATION (JP) 2009-01-29 US disclosed