Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX1 | P07099 | 3/20 | 0.38 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.37 |
| ▸ | MTNR1A | P48039 | 4/20 | 0.36 |
| ▸ | MTNR1B | P49286 | 3/20 | 0.36 |
| ▸ | NPC1 | O15118 | 1/20 | 0.36 |
| ▸ | RAB9A | P51151 | 1/20 | 0.36 |
| ▸ | MEN1 | O00255 | 2/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.35 |
| ▸ | PAOX | Q6QHF9 | 2/20 | 0.35 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | MAOA | P21397 | 1/20 | 0.33 |
| ▸ | MAOB | P27338 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3921249 | 0.98 | EPHX1 (0.41) | EPHX1KDM4EMAPK1HIF1AMTNR1A | |
| SCHEMBL3909870 | 0.98 | EPHX1 (0.41) | EPHX1KDM4EMAPK1HIF1AMTNR1A | |
| SCHEMBL728373 | 0.98 | EPHX1 (0.41) | EPHX1KDM4EMAPK1HIF1AMTNR1A | |
| SCHEMBL3909914 | 0.98 | EPHX1 (0.41) | EPHX1KDM4EMAPK1HIF1AMTNR1A | |
| SCHEMBL3920890 | 0.98 | EPHX1 (0.41) | EPHX1KDM4EMAPK1HIF1AMTNR1A | |
| SCHEMBL3910464 | 0.98 | EPHX1 (0.41) | EPHX1KDM4EMAPK1HIF1AMTNR1A | |
| SCHEMBL3911458 | 0.98 | EPHX1 (0.41) | EPHX1KDM4EMAPK1HIF1AMTNR1A | |
| SCHEMBL1142541 | 0.98 | EPHX1 (0.41) | EPHX1KDM4EMAPK1HIF1AMTNR1A | |
| SCHEMBL49082 | 0.94 | MTNR1A (0.37) | EPHX1KDM4EMAPK1HIF1AMTNR1A | |
| SCHEMBL3640242 | 0.92 | MTNR1A (0.36) | EPHX1KDM4EMAPK1HIF1AMTNR1A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12601970-B2 | Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2026-04-14 | — | — | US | disclosed |
| US-20250362601-A1 | Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component | HD MICROSYSTEMS LTD (JP) | 2025-11-27 | — | — | US | disclosed |
| EP-3255113-B1 | ADHESIVE AND/OR SEALANT COMPOSITION WITH HIGH INITIAL TACK | SOUDAL (BE) | 2025-11-05 | — | — | EP | disclosed |
| US-12386257-B2 | Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2025-08-12 | — | — | US | disclosed |
| US-12386256-B2 | Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2025-08-12 | — | — | US | disclosed |
| WO-2025095080-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED PATTERN PRODUCT, AND CURED PRODUCT | 株式会社レゾナック | 2025-05-08 | — | — | WO | disclosed |
| CN-113168101-B | Photosensitive resin composition, method for producing pattern cured film, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2025-02-18 | — | — | CN | disclosed |
| CN-113168102-B | Photosensitive resin composition, method for producing pattern cured product, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-11-19 | — | — | CN | disclosed |
| WO-2024111129-A1 | METHOD FOR PRODUCING POLYIMIDE PRECURSOR, POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING PATTERN CURED PRODUCT, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2024-05-30 | — | — | WO | disclosed |
| CN-114502617-B | Polyimide precursor, photosensitive resin composition, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-05-03 | — | — | CN | disclosed |
| US-20070003763-A1 | Release film for printed wiring board production | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2007-01-04 | — | — | US | disclosed |
| US-7151138-B2 | Resin composition of poly(aryl ketone), poly(arylene sulfide) and thermosetting imide resine | KUREHA CORPORATION (JP) | 2006-12-19 | — | — | US | disclosed |
| EP-1416015-B1 | Resin composition | KUREHA CHEMICAL IND CO LTD (JP) | 2006-01-18 | — | — | EP | disclosed |
| EP-1033388-B1 | THERMOPLASTIC RESIN COMPOSITION | KUREHA CHEMICAL IND CO LTD (JP) | 2006-01-18 | — | — | EP | disclosed |
| EP-1616909-A1 | RELEASE FILM FOR PRINTED WIRING BOARD PRODUCTION | Asahi Kasei Chemicals Corporation (JP) | 2006-01-18 | — | — | EP | disclosed |
| US-20040087733-A1 | Resin composition | KUREHA CORPORATION (JP) | 2004-05-06 | — | — | US | disclosed |
| EP-1416015-A1 | Resin composition | Kureha Chemical Industry Co., Ltd. (JP) | 2004-05-06 | — | — | EP | disclosed |
| US-6545075-B2 | Thermoplastic resin composition | KUREHA KAGAKU KOGYO K.K. (JP) | 2003-04-08 | — | — | US | disclosed |
| US-20020107335-A1 | Resin component containing a poly(arylene sulfide) and a polyamide-imide; and a silane compound containing a functional group selected from the group consisting of amino, ureido, epoxy, isocyanate and mercapto groups. | KUREHA CORPORATION (JP) | 2002-08-08 | — | — | US | disclosed |
| EP-1033388-A1 | THERMOPLASTIC RESIN COMPOSITION | KUREHA KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2000-09-06 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12601970-B2 | Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component | ARCN1, P4HA1, COL1A1 | EPHX1 139/4885KDM4E 115/4885MAPK1 3176/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.