SCHEMBL682823

SCHEMBL682823

COC(C)OCCOc1ccc(OC2CCCC2)cc1

nearest known ligand 0.43

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 3/20 0.43
ALDH1A1 P00352 2/20 0.43
ACACB O00763 4/20 0.40
CYP2D6 P10635 2/20 0.39
CYP1A2 P05177 1/20 0.39
CYP2C19 P33261 1/20 0.39
FFAR1 O14842 1/20 0.39
ALOX12 P18054 1/20 0.39
HRH3 Q9Y5N1 1/20 0.38
NFE2L2 Q16236 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL683155 0.99 KDM4E (0.42) KDM4EALDH1A1ACACBCYP2D6CYP1A2
SCHEMBL14443366 0.86 KDM4E (0.49) KDM4EALDH1A1ACACBCYP2D6CYP1A2
SCHEMBL14443369 0.85 KDM4E (0.48) KDM4EALDH1A1ACACBCYP2D6CYP1A2
SCHEMBL683430 0.82 HRH3 (0.52) KDM4EALDH1A1HRH3
SCHEMBL683429 0.81 HRH3 (0.55) KDM4EALDH1A1HRH3
SCHEMBL14287838 0.80 ALDH1A1 (0.42) KDM4EALDH1A1ACACBALOX12HRH3
SCHEMBL682836 0.80 ALDH1A1 (0.45) KDM4EALDH1A1
SCHEMBL682825 0.79 ALDH1A1 (0.44) KDM4EALDH1A1
SCHEMBL683605 0.79 ALDH1A1 (0.46) KDM4EALDH1A1ACACBCYP2D6CYP1A2
SCHEMBL19497635 0.77 CYP2C9 (0.44) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9090722-B2 Chemical amplification resist composition, and mold preparation method and resist film using the same FUJIFILM CORPORATION (JP) 2015-07-28 US disclosed
US-9090722-B2 Chemical amplification resist composition, and mold preparation method and resist film using the same FUJIFILM CORPORATION (JP) 2015-07-28 US disclosed
US-20120006788-A1 CHEMICAL AMPLIFICATION RESIST COMPOSITION, AND MOLD PREPARATION METHOD AND RESIST FILM USING THE SAME FUJIFILM CORPORATION (JP) 2012-01-12 US disclosed
US-20120006788-A1 CHEMICAL AMPLIFICATION RESIST COMPOSITION, AND MOLD PREPARATION METHOD AND RESIST FILM USING THE SAME FUJIFILM CORPORATION (JP) 2012-01-12 US disclosed
WO-2010150917-A1 CHEMICAL AMPLIFICATION RESIST COMPOSITION, AND MOLD PREPARATION METHOD AND RESIST FILM USING THE SAME FUJIFILM CORPORATION (JP) 2010-12-29 WO disclosed