SCHEMBL6842050

SCHEMBL6842050

Cc1cc(C(=O)c2ccccc2C(=O)c2cc(C)c(O)c(O)c2O)c(O)c(O)c1O

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.56
KMT2A Q03164 3/20 0.53
CYP3A4 P08684 2/20 0.53
CYP2C9 P11712 1/20 0.53
BCL2 P10415 4/20 0.49
MCL1 Q07820 3/20 0.49
HPGD P15428 2/20 0.42
KDM4E B2RXH2 1/20 0.42
HSD17B10 Q99714 1/20 0.42
MAPT P10636 3/20 0.41
GAA P10253 2/20 0.41
MEN1 O00255 2/20 0.41
MAPK1 P28482 2/20 0.41
PSMD14 O00487 1/20 0.41
HSP90AA1 P07900 1/20 0.41
MMP2 P08253 1/20 0.41
THRB P10828 1/20 0.41
NPSR1 Q6W5P4 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
POLB P06746 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10768130 0.85 FNTA (0.48) ALDH1A1KMT2ACYP3A4CYP2C9BCL2
SCHEMBL8680650 0.85 BCL2 (0.68) ALDH1A1KMT2ACYP3A4BCL2MCL1
SCHEMBL6842046 0.82 BCL2 (0.54) ALDH1A1CYP3A4BCL2MCL1HPGD
SCHEMBL9639056 0.81 HDAC1 (0.55) ALDH1A1KMT2ACYP3A4CYP2C9BCL2
SCHEMBL9640297 0.79 THRB (0.44) ALDH1A1KMT2ACYP3A4CYP2C9BCL2
SCHEMBL9639622 0.78 MEN1 (0.50) ALDH1A1KMT2ACYP3A4HPGDKDM4E
SCHEMBL9639062 0.78 CA12 (0.48) ALDH1A1CYP3A4CYP2C9MCL1HPGD
SCHEMBL7001733 0.77 KMT2A (0.68) ALDH1A1KMT2ACYP3A4CYP2C9HPGD
SCHEMBL29378415 0.77 KMT2A (0.68) ALDH1A1KMT2ACYP3A4CYP2C9HPGD
SCHEMBL28268608 0.77 KMT2A (0.68) ALDH1A1KMT2ACYP3A4CYP2C9HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250376552-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2025-12-11 US disclosed
US-20250264801-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-08-21 US disclosed
EP-4596607-A1 RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4596608-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4597225-A1 FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
US-20250236697-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-24 US disclosed
US-20250230283-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-17 US disclosed
WO-2024185652-A1 RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2024-09-12 WO disclosed
WO-2024150700-A1 RESIN COMPOSITION, CURED ARTICLE, MULTILAYER BODY, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2024-07-18 WO disclosed
WO-2024143209-A1 METHOD FOR PRODUCING MULTILAYER BODY, PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR MEMBER 富士フイルム株式会社 2024-07-04 WO disclosed
US-5523396-A ESTERIFICATION OF POLYHYDROXY COMPOUND WITH 1,2-NAPHTHOQUINONEDIAZIDE-5-SULFONYL CHLORIDE IN THE PRESENCE OF A BASIC CATALYST FUJI PHOTO FILM CO., LTD. (JP) 1996-06-04 US disclosed
EP-0710886-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1996-05-08 EP disclosed
EP-0706089-A2 Process for synthesizing quinonediazide ester and positive working photoresist containing the same FUJI PHOTO FILM CO., LTD. (JP) 1996-04-10 EP disclosed
US-5494773-A MIXTURE WITH A 1,2-QUINONEDIAZIDE COMPOUND FUJI PHOTO FILM CO., LTD. (JP) 1996-02-27 US disclosed
EP-0684521-A1 Positive working photosensitive compositions FUJI PHOTO FILM CO., LTD. (JP) 1995-11-29 EP disclosed
EP-0677789-A1 Positive photoresist composition Fuji Photo Film Co., Ltd. (JP) 1995-10-18 EP disclosed
EP-0672952-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-09-20 EP disclosed
EP-0658807-A1 Positive-working photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-06-21 EP disclosed
EP-0644460-A1 Positive working photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-03-22 EP disclosed
EP-0445819-A2 Positive type photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1991-09-11 EP disclosed