SCHEMBL6842046

SCHEMBL6842046

Cc1cc(C(=O)c2ccc(C(=O)c3cc(C)c(O)c(O)c3O)cc2)c(O)c(O)c1O

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BCL2 P10415 4/20 0.54
MCL1 Q07820 4/20 0.54
HTT P42858 2/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
MAPT P10636 6/20 0.44
ALDH1A1 P00352 5/20 0.44
KDM4E B2RXH2 4/20 0.44
HSD17B10 Q99714 3/20 0.44
HPGD P15428 3/20 0.44
ALOX15 P16050 3/20 0.44
RECQL P46063 2/20 0.44
LMNA P02545 3/20 0.43
MAPK1 P28482 2/20 0.43
CYP3A4 P08684 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
HDAC1 Q13547 1/20 0.41
HMGB1 P09429 1/20 0.40
CXCL12 P48061 1/20 0.40
BAD Q92934 1/20 0.40
AKR1C3 P42330 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8680650 0.90 BCL2 (0.68) BCL2MCL1HTTMAPTALDH1A1
SCHEMBL9639982 0.87 SIRT1 (0.47) BCL2MCL1HTTSMN1; SMN2MAPT
SCHEMBL9639016 0.84 HDAC1 (0.56) BCL2MCL1HTTSMN1; SMN2MAPT
SCHEMBL9639958 0.84 FASN (0.45) BCL2MCL1HTTSMN1; SMN2MAPT
SCHEMBL6842050 0.82 ALDH1A1 (0.56) BCL2MCL1HTTSMN1; SMN2MAPT
SCHEMBL28343594 0.79 ALDH1A1 (0.54) BCL2MCL1HTTMAPTALDH1A1
SCHEMBL9639056 0.79 HDAC1 (0.55) BCL2MCL1MAPTALDH1A1KDM4E
SCHEMBL9640297 0.77 THRB (0.44) BCL2MCL1HTTMAPTALDH1A1
SCHEMBL30336367 0.77 HTT (0.53) HTTSMN1; SMN2MAPTALDH1A1KDM4E
SCHEMBL30204449 0.77 HTT (0.53) HTTSMN1; SMN2MAPTALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250376552-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2025-12-11 US disclosed
US-20250264801-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-08-21 US disclosed
EP-4596608-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4596607-A1 RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4597225-A1 FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
US-20250236697-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-24 US disclosed
US-20250230283-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-17 US disclosed
WO-2024185652-A1 RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2024-09-12 WO disclosed
WO-2024150700-A1 RESIN COMPOSITION, CURED ARTICLE, MULTILAYER BODY, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2024-07-18 WO disclosed
WO-2024143211-A1 MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER 富士フイルム株式会社 2024-07-04 WO disclosed
US-5523396-A ESTERIFICATION OF POLYHYDROXY COMPOUND WITH 1,2-NAPHTHOQUINONEDIAZIDE-5-SULFONYL CHLORIDE IN THE PRESENCE OF A BASIC CATALYST FUJI PHOTO FILM CO., LTD. (JP) 1996-06-04 US disclosed
EP-0710886-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1996-05-08 EP disclosed
EP-0706089-A2 Process for synthesizing quinonediazide ester and positive working photoresist containing the same FUJI PHOTO FILM CO., LTD. (JP) 1996-04-10 EP disclosed
US-5494773-A MIXTURE WITH A 1,2-QUINONEDIAZIDE COMPOUND FUJI PHOTO FILM CO., LTD. (JP) 1996-02-27 US disclosed
EP-0684521-A1 Positive working photosensitive compositions FUJI PHOTO FILM CO., LTD. (JP) 1995-11-29 EP disclosed
EP-0677789-A1 Positive photoresist composition Fuji Photo Film Co., Ltd. (JP) 1995-10-18 EP disclosed
EP-0672952-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-09-20 EP disclosed
EP-0658807-A1 Positive-working photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-06-21 EP disclosed
EP-0644460-A1 Positive working photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1995-03-22 EP disclosed
EP-0445819-A2 Positive type photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1991-09-11 EP disclosed