Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Salicylic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 6/20 | 0.86 |
| ▸ | HPGD | P15428 | 5/20 | 0.86 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.86 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.56 |
| ▸ | CA1 | P00915 | 2/20 | 0.56 |
| ▸ | CA9 | Q16790 | 2/20 | 0.56 |
| ▸ | CA12 | O43570 | 1/20 | 0.56 |
| ▸ | CA2 | P00918 | 1/20 | 0.56 |
| ▸ | HMGB1 | P09429 | 1/20 | 0.56 |
| ▸ | CA4 | P22748 | 1/20 | 0.56 |
| ▸ | CA6 | P23280 | 1/20 | 0.56 |
| ▸ | CA7 | P43166 | 1/20 | 0.56 |
| ▸ | NAPRT | Q6XQN6 | 1/20 | 0.56 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.56 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.54 |
| ▸ | TSHR | P16473 | 2/20 | 0.54 |
| ▸ | MAPT | P10636 | 2/20 | 0.54 |
| ▸ | GAA | P10253 | 2/20 | 0.50 |
| ▸ | MPO | P05164 | 1/20 | 0.50 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Salicylic Acid SCHEMBL106935 | 0.98 | KDM4E (0.91) | KDM4EHPGDALDH1A1SMN1; SMN2CA1 | |
| Salicylic Acid SCHEMBL458273 | 0.98 | KDM4E (0.91) | KDM4EHPGDALDH1A1SMN1; SMN2CA1 | |
| Salicylic Acid SCHEMBL30718047 | 0.95 | KDM4E (0.95) | KDM4EHPGDALDH1A1SMN1; SMN2CA1 | |
| Salicylic Acid SCHEMBL8683263 | 0.95 | KDM4E (0.95) | KDM4EHPGDALDH1A1SMN1; SMN2CA1 | |
| Salicylic Acid SCHEMBL28814249 | 0.95 | KDM4E (0.86) | KDM4EHPGDALDH1A1SMN1; SMN2CA1 | |
| Salicylic Acid SCHEMBL30602285 | 0.95 | KDM4E (0.95) | KDM4EHPGDALDH1A1SMN1; SMN2CA1 | |
| Salicylic Acid SCHEMBL17135351 | 0.95 | KDM4E (0.86) | KDM4EHPGDALDH1A1SMN1; SMN2CA1 | |
| Salicylic Acid SCHEMBL503979 | 0.95 | KDM4E (0.86) | KDM4EHPGDALDH1A1SMN1; SMN2CA1 | |
| Salicylic Acid SCHEMBL22588845 | 0.95 | KDM4E (0.86) | KDM4EHPGDALDH1A1SMN1; SMN2CA1 | |
| Salicylic Acid SCHEMBL503706 | 0.95 | KDM4E (0.86) | KDM4EHPGDALDH1A1SMN1; SMN2CA1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20040225044-A1 | Tear resistant adherent gels, composites, and articles | APPLIED ELASTOMERICS, INCORPORATED | 2004-11-11 | — | — | US | disclosed |
| US-6758872-B2 | DISPERSION OF ABRASIVE GRAINS COMPRISNG COMPOUNDS OF CERIUM, COPPER, AND/OR AMMONIUM | HITACHI, LTD. (JP) | 2004-07-06 | — | — | US | disclosed |
| US-6656022-B2 | Abrasive grains having remained after polishing are easily removed | HITACHI, LTD. (JP) | 2003-12-02 | — | — | US | disclosed |
| US-6656021-B2 | Process for fabricating a semiconductor device | HITACHI, LTD. (JP) | 2003-12-02 | — | — | US | disclosed |
| US-20020090894-A1 | Method for polishing a semiconductor substrate member | RENESAS ELECTRONICS CORPORATION (JP) | 2002-07-11 | — | — | US | disclosed |
| US-20020034925-A1 | Process for fabricating a semiconductor device | RENESAS ELECTRONICS CORPORATION (JP) | 2002-03-21 | — | — | US | disclosed |
| US-20020004360-A1 | Polishing slurry | RENESAS ELECTRONICS CORPORATION (JP) | 2002-01-10 | — | — | US | disclosed |