Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 6/20 | 0.58 |
| ▸ | ESR2 | Q92731 | 6/20 | 0.58 |
| ▸ | PTPN1 | P18031 | 2/20 | 0.50 |
| ▸ | PTPN2 | P17706 | 1/20 | 0.46 |
| ▸ | PTPN6 | P29350 | 1/20 | 0.46 |
| ▸ | HSD17B1 | P14061 | 1/20 | 0.42 |
| ▸ | HSD17B2 | P37059 | 1/20 | 0.42 |
| ▸ | IDH1 | O75874 | 1/20 | 0.42 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.41 |
| ▸ | BCL2 | P10415 | 1/20 | 0.41 |
| ▸ | BCL2L1 | Q07817 | 1/20 | 0.41 |
| ▸ | AMY1A | P0DUB6 | 1/20 | 0.40 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.39 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.39 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.39 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.39 |
| ▸ | BACE1 | P56817 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13609056 | 0.92 | ESR1 (0.68) | ESR1ESR2PTPN1CYP1A2AMY1A | |
| SCHEMBL8083241 | 0.88 | ESR1 (0.45) | ESR1ESR2PTPN1PTPN2PTPN6 | |
| SCHEMBL29131806 | 0.88 | ESR2 (0.58) | ESR1ESR2HSD17B1HSD17B2IDH1 | |
| SCHEMBL2754939 | 0.85 | PTPN1 (0.54) | PTPN1PTPN2PTPN6BCL2BCL2L1 | |
| SCHEMBL30783352 | 0.82 | ESR1 (0.74) | ESR1ESR2PTPN1PTPN2PTPN6 | |
| SCHEMBL29636485 | 0.82 | ESR1 (0.68) | ESR1ESR2CYP1A2AMY1ACYP3A4 | |
| SCHEMBL4066304 | 0.82 | ESR1 (0.74) | ESR1ESR2PTPN1PTPN2PTPN6 | |
| SCHEMBL6846484 | 0.82 | ESR1 (0.74) | ESR1ESR2PTPN1PTPN2PTPN6 | |
| SCHEMBL3188653 | 0.82 | ESR1 (0.68) | ESR1ESR2CYP1A2AMY1ACYP3A4 | |
| SCHEMBL30375410 | 0.80 | ESR1 (0.66) | ESR1ESR2CYP1A2AMY1ACYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250376552-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-12-11 | — | — | US | disclosed |
| US-20250264801-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-08-21 | — | — | US | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596608-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20250236697-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-24 | — | — | US | disclosed |
| US-20250230283-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-17 | — | — | US | disclosed |
| CN-120077104-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-05-30 | — | — | CN | disclosed |
| CN-119998728-A | Film manufacturing method, photosensitive resin composition, cured product manufacturing method, cured product, and laminate | 富士胶片株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-119731225-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-03-28 | — | — | CN | disclosed |
| US-6716565-B2 | APPLICABLE TO IMAGE-FORMING MATERIALS SUCH AS THREE-DIMENSIONAL MODELLING BY LIGHT, HOLOGRAPHY, LITHOGRAPHIC PRINTING PLATES, COLOR PROOFS, PHOTORESISTS AND COLOR FILTERS, AND INKS, PAINTS AND ADHESIVES | FUJI PHOTO FILM CO., LTD. (JP) | 2004-04-06 | — | — | US | disclosed |
| US-20030057610-A1 | Applicable to image-forming materials such as three-dimensional modelling by light, holography, lithographic printing plates, color proofs, photoresists and color filters, and inks, paints and adhesives | FUJIFILM CORPORATION (JP) | 2003-03-27 | — | — | US | disclosed |
| EP-0786699-B1 | Positive photoresist composition | FUJI PHOTO FILM CO LTD (JP) | 2001-10-31 | — | — | EP | disclosed |
| US-5948587-A | MIXTURE OF ALKALI-SOLUBLE NOVOLAK, 1,2-NAPHTHOQUINONEDIAZIDESULFONIC ESTER AND PHENOLIC COMPOUND | FUJI PHOTO FILM CO., LTD. (JP) | 1999-09-07 | — | — | US | disclosed |
| US-5853949-A | Method of synthesizing polyphenol compound and positive working photoresist composition comprising polyphenol compound | FUJI PHOTO FILM CO., LTD. (JP) | 1998-12-29 | — | — | US | disclosed |
| EP-0766139-B1 | Positive working photoresist composition | FUJI PHOTO FILM CO LTD (JP) | 1998-03-25 | — | — | EP | disclosed |
| US-5683851-A | THYMOL OR ISOTHYMOL PHENOLIC RESIN, NAPHTHOQUINONEDIAZIDESULFONATE, LOW MOLECULAR WEIGHT PHENOLIC POLYHYDROXIDE | FUJI PHOTO FILM CO., LTD. (JP) | 1997-11-04 | — | — | US | disclosed |
| EP-0786699-A1 | Positive photoresist composition | Fuji Photo Film Co., Ltd. (JP) | 1997-07-30 | — | — | EP | disclosed |
| US-5620828-A | Positive photoresist composition containing quinonediazide esterification product, novolak resin and pocyhydroxy alkali dissolution accelerator | FUJI PHOTO FILM CO., LTD. (JP) | 1997-04-15 | — | — | US | disclosed |
| EP-0766139-A1 | Positive working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1997-04-02 | — | — | EP | disclosed |