SCHEMBL29131806

SCHEMBL29131806

Cc1cc(Cc2cc(-c3ccccc3)ccc2O)ccc1O

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR2 Q92731 5/20 0.58
ESR1 P03372 3/20 0.58
CYP1A2 P05177 1/20 0.51
HSD17B1 P14061 1/20 0.50
HSD17B2 P37059 1/20 0.50
BACE1 P56817 1/20 0.49
ALOX5 P09917 1/20 0.46
MEN1 O00255 2/20 0.45
HPGD P15428 2/20 0.45
ALOX15 P16050 2/20 0.45
KMT2A Q03164 2/20 0.45
HSD17B10 Q99714 2/20 0.45
CYP3A4 P08684 1/20 0.45
HIF1A Q16665 1/20 0.45
HCAR2 Q8TDS4 1/20 0.43
ACMSD Q8TDX5 1/20 0.42
MAPT P10636 2/20 0.42
IDH1 O75874 1/20 0.42
KDM4E B2RXH2 1/20 0.42
USP2 O75604 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6848727 0.88 ESR1 (0.58) ESR2ESR1CYP1A2HSD17B1HSD17B2
SCHEMBL8992573 0.83 MEN1 (0.62) ESR2CYP1A2BACE1ALOX5MEN1
SCHEMBL29738649 0.83 MEN1 (0.62) ESR2CYP1A2BACE1ALOX5MEN1
SCHEMBL28298946 0.82 ESR1 (0.63) ESR2ESR1MEN1HPGDALOX15
SCHEMBL3025005 0.82 ESR1 (0.68) ESR2ESR1ALOX5MEN1HPGD
SCHEMBL50409 0.81 BACE1 (0.62) ESR2CYP1A2HSD17B1BACE1ALOX5
SCHEMBL10558399 0.79 MEN1 (0.67) CYP1A2BACE1ALOX5MEN1HPGD
SCHEMBL171134 0.79 HSD17B1 (0.74) ESR2ESR1CYP1A2HSD17B1HSD17B2
SCHEMBL1176702 0.78 ESR1 (0.68) ESR2ESR1MEN1HPGDALOX15
SCHEMBL30485785 0.78 ESR1 (0.68) ESR2ESR1MEN1HPGDALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117099045-A Negative photosensitive resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2023-11-21 CN disclosed