SCHEMBL6860401

SCHEMBL6860401

N#CCCOCC1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23544787 0.88 TSHR (0.65)
SCHEMBL27888136 0.88 SMN1; SMN2 (0.49)
SCHEMBL9538772 0.87 TSHR (0.44)
SCHEMBL23589455 0.81 TSHR (0.39)
Water SCHEMBL16174879 0.81 TSHR (0.75)
SCHEMBL23061532 0.81 MEN1 (0.42)
SCHEMBL9004192 0.80 TSHR (0.41)
SCHEMBL14168843 0.79 LMNA (0.40)
SCHEMBL22418810 0.78 TSHR (0.79)
SCHEMBL16684221 0.78 TSHR (0.79)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 166 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023054114-A1 HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE リンテック株式会社 2023-04-06 WO claimed
EP-3001439-B1 SEMICONDUCTOR FILM AND APPLICATION LIQUID FOR ITS FABRICATION ASAHI CHEMICAL IND (JP) 2021-11-03 EP claimed
US-10944018-B2 Semiconductor film and semiconductor element ASAHI KASEI KABUSHIKI KAISHA (JP) 2021-03-09 US claimed
EP-2654094-B1 POLYMER COMPOSITE PIEZOELECTRIC BODY AND METHOD FOR PRODUCING SAME FUJIFILM CORP (JP) 2020-07-29 EP claimed
US-8771541-B2 Polymer composite piezoelectric body and manufacturing method for the same FUJIFILM CORPORATION (JP) 2014-07-08 US claimed
EP-2654094-A1 POLYMER COMPOSITE PIEZOELECTRIC BODY AND METHOD FOR PRODUCING SAME FUJIFILM Corporation (JP) 2013-10-23 EP claimed
US-20130256581-A1 POLYMER COMPOSITE PIEZOELECTRIC BODY AND MANUFACTURING METHOD FOR THE SAME FUJIFILM CORPORATION (JP) 2013-10-03 US claimed
EP-0199529-B1 100 PERCENT SOLIDS EPOXY, NITRILE COATING COMPOSITIONS AND METHOD OF MAKING SAME THE STANDARD OIL COMPANY (US) 1990-12-27 EP claimed
EP-0199529-A2 100 Percent solids epoxy, nitrile coating compositions and method of making same THE STANDARD OIL COMPANY (US) 1986-10-29 EP claimed
US-4609686-A IN SITU COPOLYMERIZATION THE STANDARD OIL COMPANY (US) 1986-09-02 US claimed
EP-3993442-B1 ELECTROACOUSTIC CONVERSION FILM AND ELECTROACOUSTIC CONVERTER FUJIFILM CORP (JP) 2024-07-17 EP disclosed
US-20240206341-A1 LAMINATED PIEZOELECTRIC ELEMENT AND ELECTROACOUSTIC TRANSDUCER FUJIFILM CORPORATION (JP) 2024-06-20 US disclosed
US-20240179474-A1 PIEZOELECTRIC FILM AND PIEZOELECTRIC ELEMENT FUJIFILM CORPORATION (JP) 2024-05-30 US disclosed
CN-118055992-A Adhesive for high-frequency dielectric heating 琳得科株式会社 2024-05-17 CN disclosed
US-20240163615-A1 PIEZOELECTRIC FILM AND LAMINATED PIEZOELECTRIC ELEMENT FUJIFILM CORPORATION (JP) 2024-05-16 US disclosed
US-4211850-A Polyhydroxy compounds containing urethane aryl sulfonic acid hydroxyalkyl ester groups BAYER AKTIENGESELLSCHAFT (DE) 1980-07-08 US disclosed
US-4201852-A Polyurethanes based on modified polyisocyanates containing sulphonic acid ester groups and process for the production thereof BAYER AKTIENGESELLSCHAFT (DE) 1980-05-06 US disclosed
US-4189562-A Polyhydroxy compounds containing urethane aryl sulfonic acid hydroxyalkyl ester groups BAYER AKTIENGESELLSCHAFT (DE) 1980-02-19 US disclosed
US-3991036-A CHAIN EXTENSION UNIROYAL INC. (US) 1976-11-09 US disclosed
US-3940396-A POLYURETHANE INTERMEDIATES UNIROYAL INC. (US) 1976-02-24 US disclosed