Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.37 |
| ▸ | USP2 | O75604 | 1/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31351443 | 0.86 | TSHR (0.33) | TSHRALDH1A1 | |
| SCHEMBL31351401 | 0.84 | TSHR (0.38) | TSHRALDH1A1USP2CYP3A4MAPT | |
| SCHEMBL31351422 | 0.84 | TSHR (0.38) | TSHRALDH1A1USP2CYP3A4MAPT | |
| SCHEMBL153874 | 0.81 | TSHR (0.37) | TSHRALDH1A1USP2CYP3A4MAPT | |
| SCHEMBL7160180 | 0.76 | OPRM1 (0.44) | TSHRLMNA | |
| SCHEMBL27844003 | 0.76 | OPRM1 (0.44) | TSHRLMNA | |
| SCHEMBL3642485 | 0.76 | OPRM1 (0.44) | TSHRLMNA | |
| SCHEMBL2793870 | 0.76 | OPRM1 (0.37) | ALDH1A1 | |
| SCHEMBL9697340 | 0.75 | CPB2 (0.36) | TSHRALDH1A1 | |
| SCHEMBL14735329 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101917826-B | Method for increasing binding force between electric conductor and non-conductive polymer dielectric layer in printed circuit board substrate | DONGGUAN RENJI ELECTRONIC MATERIALS CO LTD | 2013-08-21 | — | — | CN | claimed |
| CN-101917826-A | Method for increasing binding force between electric conductor and non-conductive polymer dielectric layer in printed circuit board substrate | DONGGUAN RENJI ELECTRONIC MATERIALS CO LTD | 2010-12-15 | — | — | CN | claimed |
| US-6805964-B2 | CONTACTING AT LEAST ONE SIDE OF THE METAL FOIL WITH AN INERT SILANE, TITANATE OR ZIRCONATE COMPOUND TO FORM A PROTECTIVE FILM HAVING THICKNESS 0.001 TO 1 MICRON ON THE SURFACE OF THE METAL FOIL | NIKKO MATERIALS USA, INC. | 2004-10-19 | — | — | US | claimed |
| US-20030178139-A1 | Protective coatings for improved tarnish resistance in metal foils | NIKKO MATERIALS USA, INC. | 2003-09-25 | — | — | US | claimed |
| US-6589381-B2 | Contacting copper foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film, laminating metal foil to a resin selected from polyimde, polyester or epoxy resin | GOULD ELECTRONICS, INC. | 2003-07-08 | — | — | US | claimed |
| US-6537675-B1 | Protective film of at least one inert silane, titanate or zirconate overlying the first side of the metal foil; and a metal sheet having a first side and a second side, the first side overlying the protective film | GA-TEK, INC. | 2003-03-25 | — | — | US | claimed |
| US-6299721-B1 | CONTACTING FIRST SIDE OF METAL FOIL WITH SOLUTION COMPRISING HYDROCARBYLSILANE, WATER, ORGANIC SOLVENT AND TRIAZOLE COMPOUND TO FORM RESIN DUST RESISTANT FILM ON SURFACE OF METAL | GOULD ELECTRONICS INCL | 2001-10-09 | — | — | US | claimed |
| US-20010015257-A1 | Coatings for improved resin dust resistance | NIKKO MATERIALS USA, INC. | 2001-08-23 | — | — | US | claimed |
| EP-1011299-A2 | Coatings for improved resin dust resistance | GA-TEK Inc. (US) | 2000-06-21 | — | — | EP | claimed |
| WO-2025023143-A1 | GLASS CLOTH TREATMENT LIQUID AND SURFACE TREATED GLASS CLOTH | 信越化学工業株式会社 | 2025-01-30 | — | — | WO | disclosed |
| CN-101917826-B | Method for increasing binding force between electric conductor and non-conductive polymer dielectric layer in printed circuit board substrate | DONGGUAN RENJI ELECTRONIC MATERIALS CO LTD | 2013-08-21 | — | — | CN | disclosed |
| CN-102618164-A | Method for increasing binding force between electric conductor and non-conductive polymer dielectric layer in printed circuit board substrate | DONGGUAN RENJI ELECTRONIC MATERIALS CO LTD | 2012-08-01 | — | — | CN | disclosed |
| CN-101917826-A | Method for increasing binding force between electric conductor and non-conductive polymer dielectric layer in printed circuit board substrate | DONGGUAN RENJI ELECTRONIC MATERIALS CO LTD | 2010-12-15 | — | — | CN | disclosed |
| US-6805964-B2 | CONTACTING AT LEAST ONE SIDE OF THE METAL FOIL WITH AN INERT SILANE, TITANATE OR ZIRCONATE COMPOUND TO FORM A PROTECTIVE FILM HAVING THICKNESS 0.001 TO 1 MICRON ON THE SURFACE OF THE METAL FOIL | NIKKO MATERIALS USA, INC. | 2004-10-19 | — | — | US | disclosed |
| US-20030178139-A1 | Protective coatings for improved tarnish resistance in metal foils | NIKKO MATERIALS USA, INC. | 2003-09-25 | — | — | US | disclosed |
| US-6589381-B2 | Contacting copper foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film, laminating metal foil to a resin selected from polyimde, polyester or epoxy resin | GOULD ELECTRONICS, INC. | 2003-07-08 | — | — | US | disclosed |
| US-6537675-B1 | Protective film of at least one inert silane, titanate or zirconate overlying the first side of the metal foil; and a metal sheet having a first side and a second side, the first side overlying the protective film | GA-TEK, INC. | 2003-03-25 | — | — | US | disclosed |
| US-6299721-B1 | CONTACTING FIRST SIDE OF METAL FOIL WITH SOLUTION COMPRISING HYDROCARBYLSILANE, WATER, ORGANIC SOLVENT AND TRIAZOLE COMPOUND TO FORM RESIN DUST RESISTANT FILM ON SURFACE OF METAL | GOULD ELECTRONICS INCL | 2001-10-09 | — | — | US | disclosed |
| US-20010015257-A1 | Coatings for improved resin dust resistance | NIKKO MATERIALS USA, INC. | 2001-08-23 | — | — | US | disclosed |
| EP-1011299-A2 | Coatings for improved resin dust resistance | GA-TEK Inc. (US) | 2000-06-21 | — | — | EP | disclosed |