Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PDE4A | P27815 | 1/20 | 0.38 |
| ▸ | PDE4B | Q07343 | 1/20 | 0.38 |
| ▸ | PDE4C | Q08493 | 1/20 | 0.38 |
| ▸ | PDE4D | Q08499 | 1/20 | 0.38 |
| ▸ | PDE3B | Q13370 | 1/20 | 0.38 |
| ▸ | PDE3A | Q14432 | 1/20 | 0.38 |
| ▸ | ADORA2A | P29274 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12014823 | 0.78 | PDE4A (0.36) | PDE4APDE4BPDE4CPDE4DPDE3B | |
| SCHEMBL24995611 | 0.74 | PDE4A (0.34) | PDE4APDE4BPDE4CPDE4DPDE3B | |
| SCHEMBL30570890 | 0.74 | ADORA2A (0.38) | ADORA2A | |
| SCHEMBL687166 | 0.74 | ADORA2A (0.38) | ADORA2A | |
| SCHEMBL30361253 | 0.73 | ADORA2A (0.40) | ADORA2A | |
| SCHEMBL321932 | 0.73 | ADORA2A (0.40) | ADORA2A | |
| SCHEMBL12619547 | 0.72 | ALDH1A1 (0.44) | PDE4APDE4BPDE4CPDE4DPDE3B | |
| Pterine SCHEMBL4364328 | 0.69 | ADORA2A (0.63) | ADORA2A | |
| SCHEMBL9679869 | 0.69 | ADORA2A (0.38) | ADORA2A | |
| SCHEMBL16145777 | 0.67 | ALDH1A1 (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109557764-B | Chemically amplified positive photosensitive resin composition, resist pattern, method for forming the same, and electronic device | 奇美实业股份有限公司 | 2023-09-12 | — | — | CN | disclosed |
| CN-104423170-B | Photosensitive polysiloxane composition, protective film and assembly with protective film | 奇美实业股份有限公司 | 2019-05-24 | — | — | CN | disclosed |
| CN-109557764-A | Chemically amplified positive photosensitive resin composition, resist pattern and method for forming the same, and electronic device | 奇美实业股份有限公司 | 2019-04-02 | — | — | CN | disclosed |
| CN-106933034-A | Positive light anti-etching agent composition | 东京应化工业株式会社 | 2017-07-07 | — | — | CN | disclosed |
| US-9389509-B2 | Photosensitive polysiloxane composition, protecting film and element having the protecting film | CHI MEI CORPORATION (TW) | 2016-07-12 | — | — | US | disclosed |
| US-20150346601-A1 | PHOTOSENSITIVE POLYSILOXANE COMPOSITION, PROTECTIVE FILM AND ELEMENT HAVING THE PROTECTIVE FILM | CHI MEI CORPORATION (TW) | 2015-12-03 | — | — | US | disclosed |
| US-20150234275-A1 | PHOTOSENSITIVE POLYSILOXANE COMPOSITION, PROTECTING FILM AND ELEMENT HAVING THE PROTECTING FILM | CHI MEI CORPORATION (TW) | 2015-08-20 | — | — | US | disclosed |
| CN-104849962-A | Photosensitive polysiloxane composition, protective film and element with protective film | CHI MEI CORP | 2015-08-19 | — | — | CN | disclosed |
| CN-104423170-A | Photosensitive polysiloxane composition, protective film and assembly with protective film | CHI MEI CORP | 2015-03-18 | — | — | CN | disclosed |
| US-20140322651-A1 | PHOTOSENSITIVE POLYSILOXANE COMPOSITION, PROTECTING FILM AND ELEMENT HAVING THE PROTECTING FILM | CHI MEI CORPORATION (TW) | 2014-10-30 | — | — | US | disclosed |
| CN-1823108-A | Positive photoresist composition and method of forming resist pattern | TOKYO OHKA KOGYO CO LTD (JP) | 2006-08-23 | — | — | CN | disclosed |
| CN-1823107-A | positive photoresist and method of forming photoresist | TOKYO OHKA KOGYO CO LTD (JP) | 2006-08-23 | — | — | CN | disclosed |
| US-20060183048-A1 | Positive photoresist composition and resist pattern formation | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-08-17 | — | — | US | disclosed |
| US-20060166131-A1 | Positive photoresist composition and method of forming resist pattern | TOKYO OHKA KOGYO, CO., LTD. (JP) | 2006-07-27 | — | — | US | disclosed |
| EP-1664928-A2 | POSITIVE PHOTORESIST COMPOSITION AND RESIST PATTERN FORMATION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-07 | — | — | EP | disclosed |
| EP-1644426-A1 | POSITIVE PHOTORESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-04-12 | — | — | EP | disclosed |
| EP-1644427-A2 | POSITIVE PHOTORESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-04-12 | — | — | EP | disclosed |
| WO-2005029184-A2 | POSITIVE PHOTORESIST COMPOSITION AND RESIST PATTERN FORMATION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-03-31 | — | — | WO | disclosed |
| WO-2005007718-A1 | POSITIVE PHOTORESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-01-27 | — | — | WO | disclosed |
| WO-2005007719-A2 | POSITIVE PHOTORESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-01-27 | — | — | WO | disclosed |