SCHEMBL687438

SCHEMBL687438

Cc1cc(C(C)(C)c2ccc(O)cc2O)c(O)c(C(C)(C)c2ccc(O)cc2O)c1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.50
SMN1; SMN2 Q16637 3/20 0.50
CA2 P00918 3/20 0.50
TYR P14679 2/20 0.50
POLB P06746 1/20 0.50
CYP2C9 P11712 3/20 0.42
HSD17B10 Q99714 3/20 0.42
ALOX15 P16050 2/20 0.42
NR1I2 O75469 1/20 0.42
LMNA P02545 1/20 0.42
MIF P14174 1/20 0.42
HTT P42858 1/20 0.42
NFE2L2 Q16236 1/20 0.42
HSPA5 P11021 1/20 0.38
CYP2C19 P33261 2/20 0.37
HIF1A Q16665 2/20 0.37
SELL P14151 1/20 0.37
SELP P16109 1/20 0.37
SELE P16581 1/20 0.37
KDM4E B2RXH2 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30320272 1.00 ALDH1A1 (0.50) ALDH1A1SMN1; SMN2CA2TYRPOLB
SCHEMBL278382 0.86 ALDH1A1 (0.54) ALDH1A1SMN1; SMN2CA2TYRCYP2C9
SCHEMBL29375548 0.86 ALDH1A1 (0.54) ALDH1A1SMN1; SMN2CA2TYRCYP2C9
SCHEMBL8912157 0.84 ALDH1A1 (0.50) ALDH1A1SMN1; SMN2CA2TYRPOLB
SCHEMBL8644897 0.79 ALDH1A1 (0.48) ALDH1A1SMN1; SMN2TYRCYP2C9HSD17B10
SCHEMBL8977698 0.79 ALDH1A1 (0.48) ALDH1A1SMN1; SMN2TYRCYP2C9HSD17B10
SCHEMBL29131795 0.79 ALDH1A1 (0.57) ALDH1A1SMN1; SMN2CA2TYRPOLB
SCHEMBL71137 0.78 ALDH1A1 (0.67) ALDH1A1SMN1; SMN2CA2TYRPOLB
SCHEMBL30504082 0.78 ALDH1A1 (0.67) ALDH1A1SMN1; SMN2CA2TYRPOLB
SCHEMBL3653311 0.76 ALDH1A1 (0.48) ALDH1A1SMN1; SMN2TYRCYP2C9HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 99 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2203783-A2 THICK FILM RESISTS AZ Electronic Materials USA Corp. (US) 2010-07-07 EP claimed
WO-2009040661-A2 THICK FILM RESISTS AZ ELECTRONIC MATERIALS USA CORP. (DE) 2009-04-02 WO claimed
US-20090081589-A1 THICK FILM RESISTS MERCK PATENT GMBH (DE) 2009-03-26 US claimed
EP-1623274-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-02-08 EP claimed
EP-1614005-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-01-11 EP claimed
US-6905809-B2 Photoresist compositions CLARIANT FINANCE (BVI) LIMITED (VG) 2005-06-14 US claimed
WO-2004088423-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
WO-2004088424-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
US-20040197696-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-20040197704-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US claimed
CN-106933034-B Positive photoresist composition 东京应化工业株式会社 2023-01-06 CN disclosed
CN-105301899-B Photosensitive resin composition for forming insulating film in organic E L display element 东京应化工业株式会社 2020-08-07 CN disclosed
EP-2203783-B1 THICK FILM RESISTS MERCK PATENT GMBH (DE) 2019-11-13 EP disclosed
US-9851639-B2 Photoacid generating polymers containing a urethane linkage for lithography INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2017-12-26 US disclosed
US-6106994-A ESTERIFYING A POLYPHENOL COMPOUND AND NAPHTHOQUINONE-1,2-DIAZIDESULFONYL HALIDE IN THE PRESENCE OF FOR EXAMPLE MONOMETHYLDICYCLOHEXYLAMINE, AND POSITIVE PHOTOSENSITIVE COMPOSITION CONTAINS RESULTANT ESTER TOKYO OHKA KOGYO CO., LTD. (JP) 2000-08-22 US disclosed
US-6083657-A PHENOL-FORMALDEHYDE RESIN AND QUINONEDIAZIDE COMPOUND; SEMICONDUCTORS, INTEGRATED CIRCUITS TOKYO OHKA KOGYO CO., LTD. (JP) 2000-07-04 US disclosed
EP-0902326-A2 Novolak resin precursor, novolak resin and positive photoresist composition containing the novolak resin TOKYO OHKA KOGYO CO., LTD. (JP) 1999-03-17 EP disclosed
US-5601961-A QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL TOKYO OHKA KOGYO CO., LTD. (JP) 1997-02-11 US disclosed
US-5576138-A MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1996-11-19 US disclosed