SCHEMBL6882268

SCHEMBL6882268

CCOc1c(C)c(C)c(P(c2c(C)c(C)c(OCC)c(C)c2OCC)c2c(C)c(C)c(OCC)c(C)c2OCC)c(OCC)c1C

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.32
ALDH1A1 P00352 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6881699 0.91 KDM4E (0.33) KDM4EALDH1A1
SCHEMBL6884502 0.86 KDM4E (0.33) KDM4EALDH1A1
SCHEMBL6881799 0.81 KDM4E (0.33) KDM4EALDH1A1
SCHEMBL16575414 0.80 NQO1 (0.40) KDM4EALDH1A1
SCHEMBL6883230 0.72 NQO1 (0.35)
SCHEMBL25326777 0.69 KDM4E (0.33) KDM4EALDH1A1
SCHEMBL6883720 0.69
SCHEMBL27574257 0.69 NQO1 (0.32) KDM4EALDH1A1
SCHEMBL27943111 0.69 NQO1 (0.32) KDM4EALDH1A1
SCHEMBL23271679 0.65 ALDH1A1 (0.44) KDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040260039-A1 Process for producing organic compound epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained with epoxy resin MITSUI CHEMICALS, INC. (JP) 2004-12-23 US disclosed