SCHEMBL6883230

SCHEMBL6883230

CCOc1c(OCC)c(OCC)c(P(c2c(OCC)c(OCC)c(OCC)c(OCC)c2OCC)c2c(OCC)c(OCC)c(OCC)c(OCC)c2OCC)c(OCC)c1OCC

nearest known ligand 0.35

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
NQO1 P15559 1/20 0.35
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6881799 0.87 KDM4E (0.33) NQO1
SCHEMBL6884502 0.81 KDM4E (0.33) NQO1
SCHEMBL6881699 0.81 KDM4E (0.33) NQO1
SCHEMBL6880348 0.78 TSHR (0.46) TSHR
SCHEMBL6882268 0.72 KDM4E (0.32)
SCHEMBL11371628 0.67 NQO1 (0.36) NQO1TSHR
SCHEMBL16575414 0.65 NQO1 (0.40) NQO1TSHR
SCHEMBL94221 0.65 POLB (0.42) NQO1TSHR
SCHEMBL9196941 0.65 ALDH1A1 (0.48) NQO1TSHR
SCHEMBL6884538 0.64 ALDH1A1 (0.50) NQO1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040260039-A1 Process for producing organic compound epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained with epoxy resin MITSUI CHEMICALS, INC. (JP) 2004-12-23 US disclosed