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SCHEMBL6881799

SCHEMBL6881799

CCOc1c(C)c(OCC)c(OCC)c(P(c2c(OCC)c(OCC)c(C)c(OCC)c2OCC)c2c(OCC)c(OCC)c(C)c(OCC)c2OCC)c1OCC

nearest known ligand 0.33

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
▸ KDM4E B2RXH2 2/20 0.33
▸ ALDH1A1 P00352 2/20 0.33
▸ NQO1 P15559 1/20 0.31
▸ HPGD P15428 1/20 0.30
▸ HSD17B10 Q99714 1/20 0.30
▸ L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6881699 0.90 KDM4E (0.33) KDM4EALDH1A1NQO1HPGDHSD17B10
SCHEMBL6883230 0.87 NQO1 (0.35) NQO1
SCHEMBL6884502 0.85 KDM4E (0.33) KDM4EALDH1A1NQO1HPGDHSD17B10
SCHEMBL6882268 0.81 KDM4E (0.32) KDM4EALDH1A1
SCHEMBL16575414 0.78 NQO1 (0.40) KDM4EALDH1A1NQO1HPGDHSD17B10
SCHEMBL6880348 0.71 TSHR (0.46) KDM4EALDH1A1HPGDHSD17B10L3MBTL1
SCHEMBL5589217 0.69 KDM4E (0.33) KDM4EALDH1A1NQO1HPGDHSD17B10
SCHEMBL6884318 0.65 ACHE (0.31) —
SCHEMBL23271679 0.63 ALDH1A1 (0.44) KDM4EALDH1A1NQO1
SCHEMBL5588997 0.63 KDM4E (0.31) KDM4EALDH1A1HPGDHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040260039-A1 Process for producing organic compound epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained with epoxy resin MITSUI CHEMICALS, INC. (JP) 2004-12-23 — — US disclosed