SCHEMBL688784

SCHEMBL688784

O=C(O)c1ccc2c(S)cccc2c1

nearest known ligand 0.66

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTPN1 P18031 1/20 0.66
MEN1 O00255 2/20 0.48
KMT2A Q03164 2/20 0.48
CA12 O43570 1/20 0.47
CA1 P00915 1/20 0.47
CA2 P00918 1/20 0.47
CA6 P23280 1/20 0.47
CA9 Q16790 1/20 0.47
PLA2G2D Q9UNK4 1/20 0.44
GRIN2D O15399 1/20 0.44
GRIN2A Q12879 1/20 0.44
GRIN2C Q14957 1/20 0.44
ALDH1A1 P00352 2/20 0.43
HPGD P15428 2/20 0.43
MAPT P10636 1/20 0.43
UNG P13051 1/20 0.43
ERN1 O75460 1/20 0.42
FOLH1 Q04609 1/20 0.42
TTR P02766 1/20 0.42
KDM4E B2RXH2 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL689114 0.85 PLA2G2D (0.55) PTPN1MEN1KMT2ACA12CA1
SCHEMBL31357157 0.81 PTPN1 (0.70) PTPN1MEN1KMT2ACA12CA1
SCHEMBL8105665 0.80 PTPN1 (0.64) PTPN1MEN1KMT2ACA12CA1
SCHEMBL689508 0.79 MEN1 (0.52) PTPN1MEN1KMT2AGRIN2DGRIN2A
SCHEMBL70015 0.79 PTPN1 (1.00) PTPN1MEN1KMT2ACA12CA1
SCHEMBL186327 0.79 PTPN1 (0.68) PTPN1MEN1KMT2ACA12CA1
SCHEMBL29404396 0.79 PTPN1 (1.00) PTPN1MEN1KMT2ACA12CA1
SCHEMBL23809156 0.79 PTPN1 (0.62) PTPN1MEN1KMT2ACA12CA1
SCHEMBL9670483 0.79 PTPN1 (0.62) PTPN1MEN1KMT2ACA12CA1
Hydrochloric Acid SCHEMBL8522902 0.78 PTPN1 (0.96) PTPN1MEN1KMT2ACA12CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 328 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP claimed
CN-122029489-A Photosensitive resin composition, cured product, display device, and electronic component 东丽株式会社 2026-05-12 CN disclosed
EP-4738010-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT COMPRISING SAME Toray Industries, Inc. (JP) 2026-05-06 EP disclosed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
US-12545784-B2 Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device TORAY INDUSTRIES, INC. (JP) 2026-02-10 US disclosed
EP-4668018-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND SEMICONDUCTOR DEVICE USING THESE Toray Industries, Inc. (JP) 2025-12-24 EP disclosed
EP-4660704-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250355350-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
EP-4651186-A1 METHOD FOR PRODUCING MULTILAYER BODY, AND RESIN COMPOSITION Toray Industries, Inc. (JP) 2025-11-19 EP disclosed
EP-1496395-A2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-12 EP disclosed
EP-1475665-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-11-10 EP disclosed
US-20040197703-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-10-07 US disclosed
US-20040053156-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2004-03-18 US disclosed
EP-1388758-A1 Photosensitive heat resistant resin precursor composition TORAY INDUSTRIES, INC. (JP) 2004-02-11 EP disclosed
EP-1365289-A1 PRECURSOR COMPOSITION FOR POSITIVE PHOTOSENSITIVE RESIN AND DISPLAY MADE WITH THE SAME TORAY INDUSTRIES, INC. (JP) 2003-11-26 EP disclosed
US-20030194631-A1 Precursor composition for positive photosensitive resin and display made with the same TORAY INDUSTRIES, INC. (JP) 2003-10-16 US disclosed
US-6593043-B2 Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. TORAY INDUSTRIES, INC. (JP) 2003-07-15 US disclosed
US-20020090564-A1 Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. TORAY INDUSTRIES, INC. (JP) 2002-07-11 US disclosed
EP-1209523-A2 Composition of positive photosensitive resin precursor, and display device made thereof TORAY INDUSTRIES, INC. (JP) 2002-05-29 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR PTPN1 2077/4885MEN1 4037/4885KMT2A 668/4885
US-12545784-B2 Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device ASIC1, ASIC3, TET3 PTPN1 2994/4885MEN1 1473/4885KMT2A 274/4885
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 PTPN1 923/4885MEN1 2185/4885KMT2A 537/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.